Abstract
ABSTRACTEpoxy-based, particulate composites are commonly used in packaging applications for the microelectronics industry. For example molding compounds, die attach adhesives, and encapsulant resins are all polymer matrix, particulate-reinforced composites. The mechanical behavior of these materials is a function of the type of resin, the shape and size of the reinforcing particles, the filler content, etc. In this paper, we will examine the interactions of the toughening mechanisms between rubber particles and the reinforcing particles. Hybrid-particulate composites are prepared by compounding both rubber particles and disc-shaped boron nitride particles in a bisphenol A-based epoxy cured with piperidine. Interestingly, there are combinations of rubber and reinforcing particles that lead to synergistic toughening. The underlying causes for synergistic toughening will be discussed.
Dates
Type | When |
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Created | 14 years, 4 months ago (April 6, 2011, 9:25 a.m.) |
Deposited | 4 years, 6 months ago (Feb. 24, 2021, 4:29 p.m.) |
Indexed | 1 year, 1 month ago (July 11, 2024, 4:34 a.m.) |
Issued | 27 years, 7 months ago (Jan. 1, 1998) |
Published | 27 years, 7 months ago (Jan. 1, 1998) |
Published Online | 14 years, 6 months ago (Feb. 10, 2011) |
Published Print | 27 years, 7 months ago (Jan. 1, 1998) |
@article{DiBerardino_1998, title={Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites}, volume={515}, ISSN={1946-4274}, url={http://dx.doi.org/10.1557/proc-515-239}, DOI={10.1557/proc-515-239}, journal={MRS Proceedings}, publisher={Springer Science and Business Media LLC}, author={DiBerardino, M. F. and Pearson, R. A.}, year={1998} }