DOI: 10.1557/proc-309-345. Effect of Line Width on Electromigration of Textured Pure Aluminum Films

Effect of Line Width on Electromigration of Textured Pure Aluminum Films

10.1557/proc-309-345

Crossref journal-article

Springer Science and Business Media LLC

MRS Proceedings (297)

Abstract

AbstractThree conditions of pure aluminum films were deposited, patterned into electromigration test structures, and annealed at 400°C for I hour. The grain size distribution was essentially the same for all conditions, but the textures were substantially different. Electromigration failure distributions were developed at 225°C and 1 MA/cm2for line widths of both 1.8 μm and 0.5 μm. Three conditions were tested at the wider line width while the strongest and weakest textures were evaluated in the narrow line width. Texture exerts a dominant effect at the wider line width where the lines are polycrystalline. The values of t50increase as texture becomes stronger although σ varies from <0.5 for strong textures to >1 for a bimodal failure distribution in the weakest texture. In the narrow lines, the texture effect is substantially reduced, and the failure distributions are bimodal with a few early fails followed by a monomodal distribution characterized by a low cr. The electromigration behavior is discussed in terms of both texture and the line width to grain size ratio.

Bibliography

Knorr, D. B., & Rodbell, K. P. (1993). Effect of Line Width on Electromigration of Textured Pure Aluminum Films. MRS Proceedings, 309.

Authors 2

D.B. Knorr (first)
K.P. Rodbell (additional)

References 22 Referenced 7

10.1063/1.91385
{'key': 'S1946427400403416_ref018', 'first-page': '107', 'volume-title': 'Materials Reliability Issues in Microelectronics I', 'volume': '265', 'author': 'Rodbell', 'year': '1992'} / Materials Reliability Issues in Microelectronics I by Rodbell (1992)
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10.1007/BF02673335
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10.1063/1.92649
{'key': 'S1946427400403416_ref017', 'volume-title': 'Materials Reliability Issues in Microelectronics III', 'volume': '309', 'author': 'Knorr', 'year': '1993'} / Materials Reliability Issues in Microelectronics III by Knorr (1993)
{'key': 'S1946427400403416_ref012', 'first-page': '199', 'volume-title': 'Evolution of Thin Film and Surface Microstructures', 'volume': '202', 'author': 'Knorr', 'year': '1991'} / Evolution of Thin Film and Surface Microstructures by Knorr (1991)
{'key': 'S1946427400403416_ref014', 'first-page': '21', 'volume-title': 'Materials Reliability Issues in Microelectronics', 'volume': '225', 'author': 'Knorr', 'year': '1991'} / Materials Reliability Issues in Microelectronics by Knorr (1991)
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10.1109/T-ED.1984.21734
{'key': 'S1946427400403416_ref004', 'first-page': '593', 'volume-title': 'Proc. of 1st Inter. ULSI Sci. and Tech. Symp.', 'author': 'Kwok', 'year': '1987'} / Proc. of 1st Inter. ULSI Sci. and Tech. Symp. by Kwok (1987)
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10.1063/1.101054
7. Thompson C.V. and Kahn H. , J. Elect. Mater., 22 (June 1993) in press. (10.1007/BF02666402)
10.1007/BF02673334
{'key': 'S1946427400403416_ref015', 'first-page': '113', 'volume-title': 'Materials Reliability Issues in Microelectronics II', 'volume': '265', 'author': 'Knorr', 'year': '1992'} / Materials Reliability Issues in Microelectronics II by Knorr (1992)
10.1116/1.574977
10.1063/1.104869
{'key': 'S1946427400403416_ref020', 'first-page': '118', 'volume-title': 'Handbook of Grain and Interphase Boundary Diffusion Data', 'volume': '1', 'author': 'Kauer', 'year': '1989'} / Handbook of Grain and Interphase Boundary Diffusion Data by Kauer (1989)
10.1063/1.1658395

Dates

Type	When
Created	14 years, 5 months ago (March 3, 2011, 11:10 a.m.)
Deposited	3 years, 9 months ago (Nov. 19, 2021, 2:46 p.m.)
Indexed	1 year, 6 months ago (Feb. 2, 2024, 1:09 p.m.)
Issued	32 years, 7 months ago (Jan. 1, 1993)
Published	32 years, 7 months ago (Jan. 1, 1993)
Published Online	14 years, 6 months ago (Feb. 21, 2011)
Published Print	32 years, 7 months ago (Jan. 1, 1993)

Funders 0

None

BibTeX

@article{Knorr_1993, title={Effect of Line Width on Electromigration of Textured Pure Aluminum Films}, volume={309}, ISSN={1946-4274}, url={http://dx.doi.org/10.1557/proc-309-345}, DOI={10.1557/proc-309-345}, journal={MRS Proceedings}, publisher={Springer Science and Business Media LLC}, author={Knorr, D.B. and Rodbell, K.P.}, year={1993} }

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