DOI: 10.1557/proc-309-133. Characterization of Two Electromigration Failure Modes In Submicron Vlsi

Characterization of Two Electromigration Failure Modes In Submicron Vlsi

10.1557/proc-309-133

Crossref journal-article

Springer Science and Business Media LLC

MRS Proceedings (297)

Abstract

AbstractGrain-bondary erosion-type voids and transgranular slit-like voids are found to be two competing electromigration failure modes in VLSI interconnects. The effects of interconnect linewidth, microstructure, process variables and stress conditions on the two failure modes were studied.

Bibliography

Atakov, E., Clement, JJ., & Miner, B. (1993). Characterization of Two Electromigration Failure Modes In Submicron Vlsi. MRS Proceedings, 309.

Authors 3

Em Atakov (first)
JJ. Clement (additional)
B. Miner (additional)

References 18 Referenced 16

10.1063/1.1658395
{'key': 'S1946427400403118_ref017', 'first-page': '219', 'volume-title': 'Materials Reliability in Microelectronics II', 'volume': '265', 'author': 'Chiang', 'year': '1992'} / Materials Reliability in Microelectronics II by Chiang (1992)
{'key': 'S1946427400403118_ref016', 'first-page': '131', 'volume-title': 'Materials Reliability in Microelectronics II', 'volume': '265', 'author': 'Sanchez', 'year': '1992'} / Materials Reliability in Microelectronics II by Sanchez (1992)
10.1063/1.108284
10.1063/1.107161
{'key': 'S1946427400403118_ref011', 'first-page': '219', 'volume-title': 'Materials Reliability Issues in Microelectronics', 'volume': '225', 'author': 'Walton', 'year': '1991'} / Materials Reliability Issues in Microelectronics by Walton (1991)
10.1063/1.348738
{'key': 'S1946427400403118_ref002', 'first-page': '35', 'volume-title': 'Materials Reliability Issues in Microelectronics', 'volume': '225', 'author': 'Ross', 'year': '1991'} / Materials Reliability Issues in Microelectronics by Ross (1991)
10.1007/BF02673335
10.1063/1.322842
10.1109/PROC.1969.7340
10.1116/1.585050
{'key': 'S1946427400403118_ref005', 'first-page': '165', 'volume-title': 'Proc. IEEE International Reliability Physics Symposiurn', 'author': 'Vaidya', 'year': '1980'} / Proc. IEEE International Reliability Physics Symposiurn by Vaidya (1980)
10.1063/1.91385
10.1063/1.101054
12. Atakov E.M. , Clement J.J. , and Miner B. (in preparation).
10.1063/1.348659
10.1063/1.99958

Dates

Type	When
Created	14 years, 5 months ago (March 3, 2011, 11:10 a.m.)
Deposited	4 years, 5 months ago (Feb. 24, 2021, 4:12 p.m.)
Indexed	1 year, 6 months ago (Feb. 2, 2024, 3:38 p.m.)
Issued	32 years, 7 months ago (Jan. 1, 1993)
Published	32 years, 7 months ago (Jan. 1, 1993)
Published Online	14 years, 6 months ago (Feb. 21, 2011)
Published Print	32 years, 7 months ago (Jan. 1, 1993)

Funders 0

None

BibTeX

@article{Atakov_1993, title={Characterization of Two Electromigration Failure Modes In Submicron Vlsi}, volume={309}, ISSN={1946-4274}, url={http://dx.doi.org/10.1557/proc-309-133}, DOI={10.1557/proc-309-133}, journal={MRS Proceedings}, publisher={Springer Science and Business Media LLC}, author={Atakov, Em and Clement, JJ. and Miner, B.}, year={1993} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2024,
        2,
        2
      ]
    ],
    "date-time": "2024-02-02T20:38:42Z",
    "timestamp": 1706906322269
  },
  "reference-count": 18,
  "publisher": "Springer Science and Business Media LLC",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            2011,
            2,
            21
          ]
        ],
        "date-time": "2011-02-21T00:00:00Z",
        "timestamp": 1298246400000
      },
      "content-version": "unspecified",
      "delay-in-days": 6625,
      "URL": "https://www.cambridge.org/core/terms"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        1993
      ]
    ]
  },
  "abstract": "<jats:title>Abstract</jats:title><jats:p>Grain-bondary erosion-type voids and transgranular slit-like voids are found to be two competing electromigration failure modes in VLSI interconnects. The effects of interconnect linewidth, microstructure, process variables and stress conditions on the two failure modes were studied.</jats:p>",
  "DOI": "10.1557/proc-309-133",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2011,
        3,
        3
      ]
    ],
    "date-time": "2011-03-03T16:10:15Z",
    "timestamp": 1299168615000
  },
  "source": "Crossref",
  "is-referenced-by-count": 16,
  "title": "Characterization of Two Electromigration Failure Modes In Submicron Vlsi",
  "prefix": "10.1557",
  "volume": "309",
  "author": [
    {
      "given": "Em",
      "family": "Atakov",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "JJ.",
      "family": "Clement",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "B.",
      "family": "Miner",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "297",
  "published-online": {
    "date-parts": [
      [
        2011,
        2,
        21
      ]
    ]
  },
  "reference": [
    {
      "key": "S1946427400403118_ref008",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1658395"
    },
    {
      "key": "S1946427400403118_ref017",
      "first-page": "219",
      "volume-title": "Materials Reliability in Microelectronics II",
      "volume": "265",
      "author": "Chiang",
      "year": "1992"
    },
    {
      "key": "S1946427400403118_ref016",
      "first-page": "131",
      "volume-title": "Materials Reliability in Microelectronics II",
      "volume": "265",
      "author": "Sanchez",
      "year": "1992"
    },
    {
      "key": "S1946427400403118_ref015",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.108284"
    },
    {
      "key": "S1946427400403118_ref014",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.107161"
    },
    {
      "key": "S1946427400403118_ref011",
      "first-page": "219",
      "volume-title": "Materials Reliability Issues in Microelectronics",
      "volume": "225",
      "author": "Walton",
      "year": "1991"
    },
    {
      "key": "S1946427400403118_ref009",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.348738"
    },
    {
      "key": "S1946427400403118_ref002",
      "first-page": "35",
      "volume-title": "Materials Reliability Issues in Microelectronics",
      "volume": "225",
      "author": "Ross",
      "year": "1991"
    },
    {
      "key": "S1946427400403118_ref001",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/BF02673335"
    },
    {
      "key": "S1946427400403118_ref003",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.322842"
    },
    {
      "key": "S1946427400403118_ref013",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/PROC.1969.7340"
    },
    {
      "key": "S1946427400403118_ref018",
      "doi-asserted-by": "publisher",
      "DOI": "10.1116/1.585050"
    },
    {
      "key": "S1946427400403118_ref005",
      "first-page": "165",
      "volume-title": "Proc. IEEE International Reliability Physics Symposiurn",
      "author": "Vaidya",
      "year": "1980"
    },
    {
      "key": "S1946427400403118_ref004",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.91385"
    },
    {
      "key": "S1946427400403118_ref007",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.101054"
    },
    {
      "key": "S1946427400403118_ref012",
      "unstructured": "12. Atakov E.M. , Clement J.J. , and Miner B. (in preparation)."
    },
    {
      "key": "S1946427400403118_ref006",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.348659"
    },
    {
      "key": "S1946427400403118_ref010",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.99958"
    }
  ],
  "container-title": "MRS Proceedings",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400403118",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2021,
        2,
        24
      ]
    ],
    "date-time": "2021-02-24T21:12:51Z",
    "timestamp": 1614201171000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://link.springer.com/10.1557/PROC-309-133"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1993
      ]
    ]
  },
  "references-count": 18,
  "alternative-id": [
    "S1946427400403118"
  ],
  "URL": "http://dx.doi.org/10.1557/PROC-309-133",
  "relation": {},
  "ISSN": [
    "0272-9172",
    "1946-4274"
  ],
  "subject": [],
  "container-title-short": "MRS Proc.",
  "published": {
    "date-parts": [
      [
        1993
      ]
    ]
  },
  "article-number": "133"
}