DOI: 10.1557/proc-309-101. Modelling Electromigration and Induced Stresses In Aluminum Lines

Modelling Electromigration and Induced Stresses In Aluminum Lines

10.1557/proc-309-101

Crossref journal-article

Springer Science and Business Media LLC

MRS Proceedings (297)

Abstract

AbstractThe various equations used by different authors for describing electromigration are compiled. All of them can be derived from a general equation which is based on a vacancy model. During the derivation of simplified versions of the general equations assumptions have to be made and their effect on concentration profiles and/or electromigration stresses developing as a function of time are discussed. Consequences with respect to Blech's experiment or the current exponent in Black's equation are taken into consideration and a simple explanation is provided for the beneficial effect of a (111) texture on the reliability of Al-lines.

Bibliography

Kirchheim, R. (1993). Modelling Electromigration and Induced Stresses In Aluminum Lines. MRS Proceedings, 309.

Authors 1

R. Kirchheim (first)

References 28 Referenced 20

10.1002/pssb.2220910112
10.1557/PROC-239-695
27. Kaeber U. , Thesis, University of Stuttgart, Germany (1992)
{'volume-title': 'Proc. of Int. Conf. on Diffusion in Materials', 'author': 'Hehenkamp', 'key': 'S1946427400403076_ref018'} / Proc. of Int. Conf. on Diffusion in Materials by Hehenkamp
10.1063/1.336731
10.1063/1.42691
10.1016/0036-9748(87)90253-5
10.1016/0040-6090(81)90404-1
10.1016/0001-6160(54)90061-9
{'key': 'S1946427400403076_ref024', 'first-page': '843', 'volume': '66', 'author': 'Sommer', 'year': '1989', 'journal-title': 'Defect and Diffusion Forum'} / Defect and Diffusion Forum by Sommer (1989)
10.1016/0001-6160(56)90120-1
17. 18. Hemmert R.S. and Costa M. , IEEE Proc. Int. Reliab. Phys. Symp. (1991) 64 (10.1109/IRPS.1991.363212)
10.1063/1.350305
20. Black J.R. , IEEE Proceedings, Int. Reliab. Symp. (1967) 148
{'key': 'S1946427400403076_ref021', 'first-page': '179', 'volume-title': 'Proc. of 3rd European Symp. on Reliability of Electron Devices, Failure Physics and Analysis', 'author': 'Kirchheim', 'year': '1992'} / Proc. of 3rd European Symp. on Reliability of Electron Devices, Failure Physics and Analysis by Kirchheim (1992)
10.1016/0022-3697(61)90138-X
10.1016/0956-7151(92)90305-X
10.1063/1.1659998
19. Kirchheim R. , unpublished results
10.1007/BF02647548
10.1002/pssb.19670230121
15. Lloyd J.R. and Kitchin J. , these proceedings
10.1557/PROC-239-689
{'volume-title': 'Atom Movement. Diffusion and Mass Transport in Solids', 'year': '1991', 'author': 'Philibert', 'key': 'S1946427400403076_ref005'} / Atom Movement. Diffusion and Mass Transport in Solids by Philibert (1991)
{'volume-title': 'Non-Equilibrium Thermodynamics', 'year': '1969', 'author': 'deGroot', 'key': 'S1946427400403076_ref002'} / Non-Equilibrium Thermodynamics by deGroot (1969)
10.1063/1.322842
22. Makhviladze T.M. , ME. Sarychev and K.A.Valiev, Proc. 6th Int. Nesecode Conf. (1989) 521
10.1098/rspa.1977.0179

Dates

Type	When
Created	14 years, 6 months ago (March 3, 2011, 11:10 a.m.)
Deposited	6 months ago (March 3, 2025, 12:36 a.m.)
Indexed	4 weeks ago (Aug. 6, 2025, 8:57 a.m.)
Issued	32 years, 8 months ago (Jan. 1, 1993)
Published	32 years, 8 months ago (Jan. 1, 1993)
Published Online	14 years, 6 months ago (Feb. 21, 2011)
Published Print	32 years, 8 months ago (Jan. 1, 1993)

Funders 0

None

BibTeX

@article{Kirchheim_1993, title={Modelling Electromigration and Induced Stresses In Aluminum Lines}, volume={309}, ISSN={1946-4274}, url={http://dx.doi.org/10.1557/proc-309-101}, DOI={10.1557/proc-309-101}, journal={MRS Proceedings}, publisher={Springer Science and Business Media LLC}, author={Kirchheim, R.}, year={1993} }

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