DOI: 10.1557/proc-130-77. Mechanical Testing of Thin Films

10.1557/proc-130-77

Crossref journal-article

Springer Science and Business Media LLC

MRS Proceedings (297)

Abstract

AbstractMetal films used as conductors in integrated circuits must be able to withstand stresses created during their deposition, caused by mismatches in thermal expansion coefficients and by bending which occurs during manufacture and installation. These stresses may be biaxial or uniaxial in nature. This paper discusses testing techniques and gives examples of results of mechanical testing of thin metallic films of aluminum, aluminum-copper(2%), copper, and tungsten in uniaxial and biaxial tension. The film specimens were deposited on and removed from production silicon wafers in order to simulate as much as possible actual device conditions. Basic considerations for the comparison of the two testing methods are also presented.

Bibliography

Rosenmayer, C. T., Brotzen, F. R., & Gale, R. J. (1988). Mechanical Testing of Thin Films. MRS Proceedings, 130.

Authors 3

C. T. Rosenmayer (first)
F. R. Brotzen (additional)
R. J. Gale (additional)

References 18 Referenced 20

{'key': 'S1946427400418919_ref018', 'volume-title': 'Single Crystals Elastic Constants and Calculated Aggregate Properties: A HANDBOOK', 'author': 'Simmons', 'year': '1971'} / Single Crystals Elastic Constants and Calculated Aggregate Properties: A HANDBOOK by Simmons (1971)
{'key': 'S1946427400418919_ref017', 'first-page': '241', 'volume': '70', 'author': 'Brown', 'year': '1948', 'journal-title': 'Trans. ASME'} / Trans. ASME by Brown (1948)
10.1063/1.1735513
10.1016/0040-6090(81)90407-7
10.1063/1.1717724
10.1016/0040-6090(88)90390-2
10.1016/0040-6090(86)90341-X
10.1016/0040-6090(87)90357-9
{'key': 'S1946427400418919_ref006', 'first-page': '183', 'volume-title': 'Structure and Properties of Thin Films', 'author': 'Beams', 'year': '1959'} / Structure and Properties of Thin Films by Beams (1959)
{'key': 'S1946427400418919_ref016', 'first-page': '132', 'volume': '49', 'author': 'Gerard', 'year': '1951', 'journal-title': 'Trans. ASM'} / Trans. ASM by Gerard (1951)
5. Rosenmayer C. T. , Brotzen F. R. , and Brady D. P. , submitted for publication to Thin Solid Films.
{'key': 'S1946427400418919_ref002', 'first-page': '211', 'volume-title': 'Physics of Thin Films', 'volume': '3', 'author': 'Hoffman', 'year': '1966'} / Physics of Thin Films by Hoffman (1966)
10.1063/1.1735940
10.1016/0040-6090(78)90199-2
10.1016/0020-7403(79)90008-0
10.1016/0040-6090(87)90095-2
{'key': 'S1946427400418919_ref001', 'first-page': '99', 'volume-title': 'Thin Films', 'author': 'Hoffman', 'year': '1964'} / Thin Films by Hoffman (1964)
10.1063/1.1736187

Dates

Type	When
Created	14 years, 5 months ago (March 5, 2011, 9:01 p.m.)
Deposited	4 years, 5 months ago (Feb. 24, 2021, 3:32 p.m.)
Indexed	1 year, 6 months ago (Feb. 6, 2024, 1:23 a.m.)
Issued	37 years, 7 months ago (Jan. 1, 1988)
Published	37 years, 7 months ago (Jan. 1, 1988)
Published Online	14 years, 6 months ago (Feb. 22, 2011)
Published Print	37 years, 7 months ago (Jan. 1, 1988)

Funders 0

None

BibTeX

@article{Rosenmayer_1988, title={Mechanical Testing of Thin Films}, volume={130}, ISSN={1946-4274}, url={http://dx.doi.org/10.1557/proc-130-77}, DOI={10.1557/proc-130-77}, journal={MRS Proceedings}, publisher={Springer Science and Business Media LLC}, author={Rosenmayer, C. T. and Brotzen, F. R. and Gale, R. J.}, year={1988} }

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