DOI: 10.1557/jmr.2002.0337. Orientation imaging studies of Sn-based electronic solder joints

Orientation imaging studies of Sn-based electronic solder joints

10.1557/jmr.2002.0337

Crossref journal-article

Springer Science and Business Media LLC

Journal of Materials Research (297)

Abstract

Single shear lap specimens were subjected to creep, isothermal aging, and thermomechanical fatigue (TMF). Scanning electron microscopy micrographs of previously polished specimens revealed changes in surface morphology. Orientation imaging microscopy was carried out on the same specimens to study the microstructural evolution and crystal orientation changes. As-fabricated joints consistently show a preferred crystal orientation with a few minority orientations with highly preferred misorientations. Alloy additions caused an increase in the number of statistically significant crystal orientations and misorientations. The solidification microstructure was unchanged due to room-temperature creep. Aging caused development and motion of well-defined subgrain boundaries and removal of most minority orientations. TMF causes heterogeneous refinement of the microstructure that accounts for the localized grain boundary sliding in regions of high strain concentration. This study implies that the lead-free solder joints are not polycrystals, but multicrystals, so that deformation is very heterogeneous and sensitive to strain and temperature history.

Bibliography

Telang, A. A., Bieler, T. T., Choi, S., & Subramanian, K. K. (2002). Orientation imaging studies of Sn-based electronic solder joints. Journal of Materials Research, 17(9), 2294â2306.

Authors 4

A. A. Telang (first)
T. T. Bieler (additional)
S. Choi (additional)
K. K. Subramanian (additional)

References 29 Referenced 88

25. Rhee H. , Lucas J.P. , Subramanian K.N. , and Bieler T.R. , J. Mater. Sci. Mater. Sci.: Mater. Electron. (in press).
{'key': 'S088429140006163X_ref021', 'first-page': '538', 'volume-title': '42nd Electronic Components and Technology Conference (ECTC)', 'author': 'Darveaux', 'year': '1992'} / 42nd Electronic Components and Technology Conference (ECTC) by Darveaux (1992)
{'key': 'S088429140006163X_ref020', 'volume-title': 'Physical Metallurgy', 'volume': '28', 'author': 'Cahn', 'year': '1996'} / Physical Metallurgy by Cahn (1996)
10.1155/TSM.20.217
18. Lee J.G. , Telang A.U. , Subramamian K.N. , and Bieler T.R. , J. Electron. Mater. (in press).
10.1016/0921-5093(93)90310-B
10.1557/JMR.2002.0042
10.1016/S1359-6454(01)00207-5
10.1111/j.1151-2916.1998.tb02370.x
10.1007/s11664-999-0155-2
10.1007/s11664-002-0146-z
10.1007/s11664-000-0020-9
10.1016/0956-7151(92)90062-J
10.1007/BF02652148
10.1007/s11837-001-0063-2
28. Bieler T.R. and Semiatin S.L. , Int. J. Plast. (in press).
10.1016/S1359-6462(00)00354-7
{'key': 'S088429140006163X_ref001', 'first-page': '1136', 'volume-title': 'Electr. Compon. Technol. Conf.', 'author': 'Yang', 'year': '1996'} / Electr. Compon. Technol. Conf. by Yang (1996)
10.1108/09540919810203748
10.1016/S0304-3991(96)00104-0
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10.1098/rspa.1972.0120
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10.1016/1044-5803(94)90093-0
{'key': 'S088429140006163X_ref003', 'first-page': '241', 'volume-title': 'Design and Reliability of Solders and Solder Interconnections', 'author': 'Gibson', 'year': '1997'} / Design and Reliability of Solders and Solder Interconnections by Gibson (1997)
10.1557/S0883769400062448
10.1007/s11664-999-0154-3
10.1016/0927-796X(93)90009-R

Dates

Type	When
Created	17 years, 5 months ago (March 5, 2008, 9:44 p.m.)
Deposited	4 years, 6 months ago (Feb. 24, 2021, 3:11 p.m.)
Indexed	1 week, 1 day ago (Aug. 19, 2025, 6:07 a.m.)
Issued	22 years, 11 months ago (Sept. 1, 2002)
Published	22 years, 11 months ago (Sept. 1, 2002)
Published Online	14 years, 6 months ago (Jan. 31, 2011)
Published Print	22 years, 11 months ago (Sept. 1, 2002)

Funders 0

None

BibTeX

@article{Telang_2002, title={Orientation imaging studies of Sn-based electronic solder joints}, volume={17}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.2002.0337}, DOI={10.1557/jmr.2002.0337}, number={9}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Telang, A. A. and Bieler, T. T. and Choi, S. and Subramanian, K. K.}, year={2002}, month=sep, pages={2294–2306} }

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