DOI: 10.1557/jmr.2001.0229. Interfacial embrittlement by bismuth segregation in copper/tin

Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect

10.1557/jmr.2001.0229

Crossref journal-article

Springer Science and Business Media LLC

Journal of Materials Research (297)

Abstract

Microchemistry and mechanical properties of a copper/tin–bismuth Pb-free solder interconnect were examined in the as-reflowed and aged conditions by in situ Auger fracture and interface fracture mechanics techniques. In the as-reflowed condition, the solder–copper interface was highly resistant to fracture, and the fracture mechanism was ductile with the crack path following the interface between the solder alloy and the copper–tin intermetallic phase. Upon thermal aging, bismuth segregation was found to occur on the copper–intermetallic interface. Auger depth profiling indicated that the segregation was confined to about one monolayer from the interface. The segregation was shown to embrittle the interface, resulting in an approximately 5-fold decrease in the interfacial fracture resistance.

Bibliography

Liu, P. L., & Shang, J. K. (2001). Interfacial embrittlement by bismuth segregation in copper/tinâbismuth Pb-free solder interconnect. Journal of Materials Research, 16(6), 1651â1659.

Authors 2

P. L. Liu (first)
J. K. Shang (additional)

References 32 Referenced 81

{'key': 'S0884291400069454_ref029', 'first-page': '205', 'volume': '20', 'author': 'Ritchie', 'year': '1979', 'journal-title': 'Int. Metals Rev.'} / Int. Metals Rev. by Ritchie (1979)
10.1007/s11664-000-0056-x
10.1007/BF02647760
10.1063/1.346827
10.1016/0001-6160(73)90031-X
{'key': 'S0884291400069454_ref013', 'first-page': '28', 'volume': '45', 'author': 'Felton', 'year': '1993', 'journal-title': 'J. Met.'} / J. Met. by Felton (1993)
10.1007/BF02669424
10.1007/BF02665483
{'key': 'S0884291400069454_ref002', 'first-page': '29', 'volume': '26', 'author': 'Lee', 'year': '1999', 'journal-title': 'Adv. Microelectr.'} / Adv. Microelectr. by Lee (1999)
10.1108/09540919710800656
10.1016/S1359-6454(99)00264-5
{'key': 'S0884291400069454_ref005', 'first-page': '252', 'volume-title': 'Proceedings of the 9th International Microelectronics Confer-ence', 'author': 'Yamagishi', 'year': '1996'} / Proceedings of the 9th International Microelectronics Confer-ence by Yamagishi (1996)
10.1103/PhysRevLett.67.1894
10.1016/S1359-6454(99)00265-7
10.1103/PhysRevB.47.5571
10.1007/BF02655427
10.1179/imr.1995.40.2.65
10.1007/BF01132413
{'key': 'S0884291400069454_ref032', 'first-page': '229', 'volume-title': 'Materials Developments in Microelectronic Packaging Conference Proceedings', 'author': 'Frear', 'year': '1991'} / Materials Developments in Microelectronic Packaging Conference Proceedings by Frear (1991)
10.1016/0001-6160(89)90238-1
{'key': 'S0884291400069454_ref001', 'first-page': '399', 'volume-title': 'Proceedings of SMTA Inter-national', 'author': 'Mei', 'year': '1999'} / Proceedings of SMTA Inter-national by Mei (1999)
10.1115/1.2904363
10.1016/S1359-6462(98)00005-0
10.1007/BF02644391
{'key': 'S0884291400069454_ref003', 'first-page': '277', 'volume-title': 'Proceedings of 48th Electronic Components and Technology Conference', 'author': 'Hua', 'year': '1998'} / Proceedings of 48th Electronic Components and Technology Conference by Hua (1998)
10.1016/S1359-6454(99)00168-8
10.1007/BF02651365
10.1007/BF02655468
{'key': 'S0884291400069454_ref031', 'first-page': '1249', 'volume': '25A', 'author': 'Kramer', 'year': '1995', 'journal-title': 'Metall. Mater. Trans.'} / Metall. Mater. Trans. by Kramer (1995)
26. Zhang Z. , Ph.D. Thesis, University of Illinois at Urbana-Champaign, Urbana, Illinois (1997).
{'key': 'S0884291400069454_ref028', 'first-page': '286', 'volume': '31A', 'author': 'Liu', 'year': '2000', 'journal-title': 'Metall. Mater. Trans. A'} / Metall. Mater. Trans. A by Liu (2000)
10.1007/BF02665064

Dates

Type	When
Created	17 years, 5 months ago (March 13, 2008, 6:42 a.m.)
Deposited	4 years, 5 months ago (Feb. 24, 2021, 3:07 p.m.)
Indexed	1 month, 1 week ago (July 16, 2025, 8:53 a.m.)
Issued	24 years, 2 months ago (June 1, 2001)
Published	24 years, 2 months ago (June 1, 2001)
Published Online	14 years, 6 months ago (Jan. 31, 2011)
Published Print	24 years, 2 months ago (June 1, 2001)

Funders 0

None

BibTeX

@article{Liu_2001, title={Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect}, volume={16}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.2001.0229}, DOI={10.1557/jmr.2001.0229}, number={6}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Liu, P. L. and Shang, J. K.}, year={2001}, month=jun, pages={1651–1659} }

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