DOI: 10.1557/jmr.2001.0169. Stability of channels at a scalloplike Cu<sub>6</sub>Sn<sub>5</sub> layer in solder interconnections

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

10.1557/jmr.2001.0169

Crossref journal-article

Springer Science and Business Media LLC

Journal of Materials Research (297)

Abstract

The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5 layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu6Sn5 substrate. The orientational relationship between the grains of the Cu6Sn5 layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.

Bibliography

Lee, J.-H., Park, J.-H., Lee, Y.-H., Kim, Y.-S., & Shin, D. H. (2001). Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections. Journal of Materials Research, 16(5), 1227â1230.

Authors 5

Jong-Hyun Lee (first)
Jong-Hwan Park (additional)
Yong-Ho Lee (additional)
Yong-Seog Kim (additional)
Dong Hyuk Shin (additional)

References 23 Referenced 29

{'key': 'S0884291400062919_ref022', 'first-page': '191', 'volume-title': 'Solder Mechanics: A State of the Art Assessment', 'author': 'Romig', 'year': '1991'} / Solder Mechanics: A State of the Art Assessment by Romig (1991)
{'key': 'S0884291400062919_ref008', 'first-page': '29', 'volume-title': 'Solder Mechanics: A State of the Art Assessment', 'author': 'Romig', 'year': '1991'} / Solder Mechanics: A State of the Art Assessment by Romig (1991)
{'key': 'S0884291400062919_ref015', 'first-page': '247', 'volume-title': 'Design and Reliability of Solders and Solder Interconnections', 'author': 'Schaefer', 'year': '1997'} / Design and Reliability of Solders and Solder Interconnections by Schaefer (1997)
10.1063/1.113975
10.1007/BF02666735
10.1063/1.371460
10.1016/0001-6160(82)90201-2
10.1007/BF02675563
10.2320/matertrans1960.16.539
{'key': 'S0884291400062919_ref010', 'first-page': '329', 'volume': '43', 'author': 'Bader', 'year': '1995', 'journal-title': 'Acta Metall. Mater.'} / Acta Metall. Mater. by Bader (1995)
10.1007/s11663-997-0020-8
10.1063/1.114767
{'key': 'S0884291400062919_ref004', 'first-page': '93', 'volume-title': 'Solder Joint Reliability', 'author': 'Lau', 'year': '1994'} / Solder Joint Reliability by Lau (1994)
10.1007/BF02651374
{'key': 'S0884291400062919_ref001', 'first-page': '355', 'volume': '15', 'author': 'Quan', 'year': '1987', 'journal-title': 'J. Electron. Mater.'} / J. Electron. Mater. by Quan (1987)
10.1007/s11664-999-0157-0
10.1007/s11664-998-0066-7
{'key': 'S0884291400062919_ref023', 'first-page': '49', 'volume': '11', 'author': 'London', 'year': '1986', 'journal-title': 'Brazing Soldering'} / Brazing Soldering by London (1986)
{'key': 'S0884291400062919_ref002', 'first-page': '373', 'author': 'Dirnfeld', 'year': '1990', 'journal-title': 'Welding J. (Res. Suppl.) Oct.'} / Welding J. (Res. Suppl.) Oct. by Dirnfeld (1990)
{'key': 'S0884291400062919_ref003', 'first-page': '229', 'author': 'Frear', 'year': '1991', 'journal-title': 'Proc. Mater. Develop. Microelectron. Packag. Conf.'} / Proc. Mater. Develop. Microelectron. Packag. Conf. by Frear (1991)
10.1103/PhysRevB.53.16027
{'key': 'S0884291400062919_ref014', 'first-page': '161', 'volume-title': 'Design and Reliability of Solders and Solder Interconnections', 'author': 'Vianco', 'year': '1997'} / Design and Reliability of Solders and Solder Interconnections by Vianco (1997)
{'key': 'S0884291400062919_ref005', 'volume-title': 'Soldering in Electronics', 'author': 'Klein Wassink', 'year': '1989'} / Soldering in Electronics by Klein Wassink (1989)

Dates

Type	When
Created	17 years, 5 months ago (March 5, 2008, 9:39 p.m.)
Deposited	4 years, 5 months ago (Feb. 24, 2021, 3:07 p.m.)
Indexed	1 year ago (Aug. 12, 2024, 12:32 p.m.)
Issued	24 years, 3 months ago (May 1, 2001)
Published	24 years, 3 months ago (May 1, 2001)
Published Online	14 years, 6 months ago (Jan. 31, 2011)
Published Print	24 years, 3 months ago (May 1, 2001)

Funders 0

None

BibTeX

@article{Lee_2001, title={Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections}, volume={16}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.2001.0169}, DOI={10.1557/jmr.2001.0169}, number={5}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Lee, Jong-Hyun and Park, Jong-Hwan and Lee, Yong-Ho and Kim, Yong-Seog and Shin, Dong Hyuk}, year={2001}, month=may, pages={1227–1230} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2024,
        8,
        12
      ]
    ],
    "date-time": "2024-08-12T16:32:09Z",
    "timestamp": 1723480329320
  },
  "reference-count": 23,
  "publisher": "Springer Science and Business Media LLC",
  "issue": "5",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            2011,
            1,
            31
          ]
        ],
        "date-time": "2011-01-31T00:00:00Z",
        "timestamp": 1296432000000
      },
      "content-version": "unspecified",
      "delay-in-days": 3562,
      "URL": "https://www.cambridge.org/core/terms"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2001,
        5
      ]
    ]
  },
  "abstract": "<jats:p>The thermodynamic stability of the solder channels at a scalloplike Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> substrate. The orientational relationship between the grains of the Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.</jats:p>",
  "DOI": "10.1557/jmr.2001.0169",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2008,
        3,
        6
      ]
    ],
    "date-time": "2008-03-06T02:39:46Z",
    "timestamp": 1204771186000
  },
  "page": "1227-1230",
  "source": "Crossref",
  "is-referenced-by-count": 29,
  "title": "Stability of channels at a scalloplike Cu<sub>6</sub>Sn<sub>5</sub> layer in solder interconnections",
  "prefix": "10.1557",
  "volume": "16",
  "author": [
    {
      "given": "Jong-Hyun",
      "family": "Lee",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "Jong-Hwan",
      "family": "Park",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "Yong-Ho",
      "family": "Lee",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "Yong-Seog",
      "family": "Kim",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "Dong Hyuk",
      "family": "Shin",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "297",
  "published-online": {
    "date-parts": [
      [
        2011,
        1,
        31
      ]
    ]
  },
  "reference": [
    {
      "key": "S0884291400062919_ref022",
      "first-page": "191",
      "volume-title": "Solder Mechanics: A State of the Art Assessment",
      "author": "Romig",
      "year": "1991"
    },
    {
      "key": "S0884291400062919_ref008",
      "first-page": "29",
      "volume-title": "Solder Mechanics: A State of the Art Assessment",
      "author": "Romig",
      "year": "1991"
    },
    {
      "key": "S0884291400062919_ref015",
      "first-page": "247",
      "volume-title": "Design and Reliability of Solders and Solder Interconnections",
      "author": "Schaefer",
      "year": "1997"
    },
    {
      "key": "S0884291400062919_ref019",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.113975"
    },
    {
      "key": "S0884291400062919_ref012",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/BF02666735"
    },
    {
      "key": "S0884291400062919_ref020",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.371460"
    },
    {
      "key": "S0884291400062919_ref007",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/0001-6160(82)90201-2"
    },
    {
      "key": "S0884291400062919_ref009",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/BF02675563"
    },
    {
      "key": "S0884291400062919_ref006",
      "doi-asserted-by": "publisher",
      "DOI": "10.2320/matertrans1960.16.539"
    },
    {
      "key": "S0884291400062919_ref010",
      "first-page": "329",
      "volume": "43",
      "author": "Bader",
      "year": "1995",
      "journal-title": "Acta Metall. Mater."
    },
    {
      "key": "S0884291400062919_ref013",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/s11663-997-0020-8"
    },
    {
      "key": "S0884291400062919_ref021",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.114767"
    },
    {
      "key": "S0884291400062919_ref004",
      "first-page": "93",
      "volume-title": "Solder Joint Reliability",
      "author": "Lau",
      "year": "1994"
    },
    {
      "key": "S0884291400062919_ref018",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/BF02651374"
    },
    {
      "key": "S0884291400062919_ref001",
      "first-page": "355",
      "volume": "15",
      "author": "Quan",
      "year": "1987",
      "journal-title": "J. Electron. Mater."
    },
    {
      "key": "S0884291400062919_ref017",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/s11664-999-0157-0"
    },
    {
      "key": "S0884291400062919_ref016",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/s11664-998-0066-7"
    },
    {
      "key": "S0884291400062919_ref023",
      "first-page": "49",
      "volume": "11",
      "author": "London",
      "year": "1986",
      "journal-title": "Brazing Soldering"
    },
    {
      "key": "S0884291400062919_ref002",
      "first-page": "373",
      "author": "Dirnfeld",
      "year": "1990",
      "journal-title": "Welding J. (Res. Suppl.) Oct."
    },
    {
      "key": "S0884291400062919_ref003",
      "first-page": "229",
      "author": "Frear",
      "year": "1991",
      "journal-title": "Proc. Mater. Develop. Microelectron. Packag. Conf."
    },
    {
      "key": "S0884291400062919_ref011",
      "doi-asserted-by": "publisher",
      "DOI": "10.1103/PhysRevB.53.16027"
    },
    {
      "key": "S0884291400062919_ref014",
      "first-page": "161",
      "volume-title": "Design and Reliability of Solders and Solder Interconnections",
      "author": "Vianco",
      "year": "1997"
    },
    {
      "key": "S0884291400062919_ref005",
      "volume-title": "Soldering in Electronics",
      "author": "Klein Wassink",
      "year": "1989"
    }
  ],
  "container-title": "Journal of Materials Research",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S0884291400062919",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2021,
        2,
        24
      ]
    ],
    "date-time": "2021-02-24T20:07:07Z",
    "timestamp": 1614197227000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://link.springer.com/10.1557/JMR.2001.0169"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2001,
        5
      ]
    ]
  },
  "references-count": 23,
  "journal-issue": {
    "issue": "5",
    "published-print": {
      "date-parts": [
        [
          2001,
          5
        ]
      ]
    }
  },
  "alternative-id": [
    "S0884291400062919"
  ],
  "URL": "http://dx.doi.org/10.1557/JMR.2001.0169",
  "relation": {},
  "ISSN": [
    "0884-2914",
    "2044-5326"
  ],
  "subject": [],
  "container-title-short": "J. Mater. Res.",
  "published": {
    "date-parts": [
      [
        2001,
        5
      ]
    ]
  }
}