Abstract
Force-strain curves were measured for 1.0 μm and 1.5 μm thick Cu0.57Ni0.42Mn0.01 films on 8 μm thick polyimide foils by tensile testing. By separating the force working on the polyimide foil from that working on the metal-polyimide compound, stress-strain curves for the CuNi(Mn) films were obtained. Young's modulus and tensile strength were determined for as-deposited and annealed [350 °C, 1 h, N2/H2(5 vol%) atmosphere] films by this method. Crack propagation starts at the end of the elastic region at 0.2 to 0.7% strain, depending on the film thickness and the thermal treatment. The cracking behavior is described by a steady-state approximation.
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Dates
Type | When |
---|---|
Created | 17 years, 5 months ago (March 5, 2008, 9:24 p.m.) |
Deposited | 4 years, 5 months ago (Feb. 24, 2021, 5:07 p.m.) |
Indexed | 1 year, 2 months ago (June 7, 2024, 12:38 a.m.) |
Issued | 26 years, 10 months ago (Oct. 1, 1998) |
Published | 26 years, 10 months ago (Oct. 1, 1998) |
Published Online | 14 years, 6 months ago (Jan. 31, 2011) |
Published Print | 26 years, 10 months ago (Oct. 1, 1998) |
@article{Macionczyk_1998, title={Young’s modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing}, volume={13}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.1998.0390}, DOI={10.1557/jmr.1998.0390}, number={10}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Macionczyk, F. and Brückner, W. and Pitschke, W. and Reiss, G.}, year={1998}, month=oct, pages={2852–2858} }