DOI: 10.1557/jmr.1998.0186. Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

10.1557/jmr.1998.0186

Crossref journal-article

Springer Science and Business Media LLC

Journal of Materials Research (297)

Abstract

Thermal stresses in thin Cu films on silicon substrates were examined as a function of film thickness and presence of a silicon nitride passivation layer. At room temperature, tensile stresses increased with decreasing film thickness in qualitative agreement with a dislocation constraint model. However, in order to predict the stress levels, grain-size strengthening, which is shown to follow a Hall–Petch relation, must be superimposed. An alternative explanation is strain-hardening due to the increase in dislocation density, which was measured by x-ray diffraction. At 600 °C, the passivation increases the stress by an order of magnitude; this leads to a substantially different shape of the stress-temperature curves, which now resemble those of aluminum with only a native oxide layer. The effect of passivation is shown to be very sensitive to the deposition and test conditions.

Bibliography

Keller, R.-M., Baker, S. P., & Arzt, E. (1998). Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation. Journal of Materials Research, 13(5), 1307â1317.

Authors 3

R-M. Keller (first)
S. P. Baker (additional)
E. Arzt (additional)

References 34 Referenced 240

34. Venkatraman R. , Plasticity and Flow Stresses in Aluminum Thin Films on Silicon, Ph.D. dissertation, Stanford University (1992).
10.1007/BF02673337
10.1109/16.8790
10.1116/1.577269
10.1016/0040-6090(95)05834-6
10.1557/JMR.1994.0318
{'key': 'S0884291400044228_ref026', 'volume-title': 'Thin Films: Stresses and Mechanical Properties VI,', 'volume': '436', 'author': 'Keller', 'year': '1997'} / Thin Films: Stresses and Mechanical Properties VI, by Keller (1997)
10.1016/0040-6090(95)07087-7
10.1557/JMR.1992.2040
{'key': 'S0884291400044228_ref028', 'first-page': '6', 'volume-title': 'Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics', 'author': 'Frost', 'year': '1982'} / Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics by Frost (1982)
10.1007/BF02666659
{'key': 'S0884291400044228_ref008', 'first-page': '127', 'volume-title': 'Thin Films: Stresses and Mechanical Properties III,', 'volume': '239', 'author': 'Venkatraman', 'year': '1992'} / Thin Films: Stresses and Mechanical Properties III, by Venkatraman (1992)
{'key': 'S0884291400044228_ref027', 'first-page': '239', 'volume': '227', 'author': 'Li', 'year': '1963', 'journal-title': 'Trans. Metall. Soc. AIME'} / Trans. Metall. Soc. AIME by Li (1963)
12. Flinn P. A. , private communication.
11. The Texwipe Company, 650 East Crescent Avenue, PO.Box 575, Upper Saddle River, New Jersey 07458, TechniCloth II.
10.1007/BF02655467
20. Keller R-M. , Thermomechanisches Verhalten und Mikrostruktur dünner, polykristalliner Kupferschichten, Ph.D. dissertation, University of Stuttgart (1996).
10.1115/1.3173068
2. Vinci R. P. , Thermal Strains and Stresses in Copper Thin Films and Microelectronic Interconnect Structures, Ph.D. dissertation, Stanford University (1994).
10.1016/0956-7151(94)90486-3
16. Kretschmann A. , Ph.D. dissertation, University of Stuttgart (1997).
{'key': 'S0884291400044228_ref024', 'first-page': '167', 'volume-title': 'Mechanical Behavior of Materials', 'author': 'Courtney', 'year': '1990'} / Mechanical Behavior of Materials by Courtney (1990)
10.1109/T-ED.1987.22981
10.1557/JMR.1991.1498
{'key': 'S0884291400044228_ref004', 'first-page': '225', 'volume': '14', 'author': 'Doerner', 'year': '1988', 'journal-title': 'Solid State and Materials Sciences'} / Solid State and Materials Sciences by Doerner (1988)
9. Keller R-M. , Baker S. P. , Kretschmann A. , Vinci R. P. , and Arzt E. , unpublished.
10.1098/rspa.1909.0021
10.1063/1.343968
15. Kuschke W. M. , Kretschmann A. , Keller R-M. , Vinci R. P. , Kaufmann C. , and Arzt E. , J. Mater. Res. (in press).
{'key': 'S0884291400044228_ref017', 'first-page': '309', 'volume-title': 'Materials Reliability in Microelectronics V,', 'volume': '391', 'author': 'Keller', 'year': '1995'} / Materials Reliability in Microelectronics V, by Keller (1995)
18. Keller R-M. , Baker S. P. , and Arzt E. , unpublished.
10.1557/JMR.1986.0845
{'key': 'S0884291400044228_ref021', 'first-page': '171', 'volume-title': 'Mechanical Behavior of Materials', 'author': 'Courtney', 'year': '1990'} / Mechanical Behavior of Materials by Courtney (1990)
10.1080/01418617908239287

Dates

Type	When
Created	17 years, 5 months ago (March 13, 2008, 6:41 a.m.)
Deposited	4 years, 6 months ago (Feb. 24, 2021, 5:06 p.m.)
Indexed	3 months, 1 week ago (May 21, 2025, 4:25 p.m.)
Issued	27 years, 3 months ago (May 1, 1998)
Published	27 years, 3 months ago (May 1, 1998)
Published Online	14 years, 7 months ago (Jan. 31, 2011)
Published Print	27 years, 3 months ago (May 1, 1998)

Funders 0

None

BibTeX

@article{Keller_1998, title={Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation}, volume={13}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.1998.0186}, DOI={10.1557/jmr.1998.0186}, number={5}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Keller, R-M. and Baker, S. P. and Arzt, E.}, year={1998}, month=may, pages={1307–1317} }

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