Crossref journal-article
Springer Science and Business Media LLC
Journal of Materials Research (297)
Abstract

The reduction of dislocation density in heteroepitaxial III-V compound films on Si substrates has been studied using MOCVD (Metal-Organic Chemical Vapor Deposition). High-quality GaAs films on Si, with a dislocation density of about 106 cm−2, have been obtained by combining strained-layer superlattice insertion and thermal cycle annealing. Reduction of dislocation density in the III-V compounds on Si is discussed based on a simple model, where dislocation annihilation is assumed to be caused by dislocation movement under thermal and misfit stress. As a result of dislocation density reduction, high-efficiency GaAs-on-Si solar cells with total-area efficiencies of 18.3% (AM0) and 20% (AM1.5), and red and yellow emissions from InGaP-on-Si light-emitting diodes have been realized. Moreover, future prospects of heteroepitaxy of III-V compounds on Si are also discussed.

Bibliography

Yamaguchi, M. (1991). Dislocation density reduction in heteroepitaxial III-V compound films on Si substrates for optical devices. Journal of Materials Research, 6(2), 376–384.

Authors 1
  1. Masafumi Yamaguchi (first)
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Dates
Type When
Created 17 years, 11 months ago (Sept. 27, 2007, 6:33 a.m.)
Deposited 4 years, 6 months ago (Feb. 24, 2021, 4:35 p.m.)
Indexed 3 months ago (June 3, 2025, 1:48 a.m.)
Issued 34 years, 7 months ago (Feb. 1, 1991)
Published 34 years, 7 months ago (Feb. 1, 1991)
Published Online 14 years, 7 months ago (Jan. 31, 2011)
Published Print 34 years, 7 months ago (Feb. 1, 1991)
Funders 0

None

@article{Yamaguchi_1991, title={Dislocation density reduction in heteroepitaxial III-V compound films on Si substrates for optical devices}, volume={6}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.1991.0376}, DOI={10.1557/jmr.1991.0376}, number={2}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Yamaguchi, Masafumi}, year={1991}, month=feb, pages={376–384} }