DOI: 10.1557/jmr.1986.0845. Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

10.1557/jmr.1986.0845

Crossref journal-article

Springer Science and Business Media LLC

Journal of Materials Research (297)

Abstract

Substrate curvature and submicron indentation measurements have been used recently to study plastic deformation in thin films on substrates. In the present work both of these techniques have been employed to study the strength of aluminum and tungsten thin films on silicon substrates. In the case of aluminum films on silicon substrates, the film strength is found to increase with decreasing thickness. Grain size variations with film thickness do not account for the variations in strength. Wafer curvature measurements give strengths higher than those predicted from hardness measurements suggesting the substrate plays a role in strengthening the film. The observed strengthening effect with decreased thickness may be due to image forces on dislocations in the film due to the elastically stiffer silicon substrate. For sputtered tungsten films, where the substrate is less stiff than the film, the film strength decreases with decreasing film thickness.

Bibliography

Doerner, M. F., Gardner, D. S., & Nix, W. D. (1986). Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques. Journal of Materials Research, 1(6), 845â851.

Authors 3

M.F. Doerner (first)
D.S. Gardner (additional)
W.D. Nix (additional)

References 21 Referenced 297

{'volume-title': 'The Hardness of Metals', 'year': '1951', 'author': 'Tabor', 'key': 'S0884291400014734_ref016'} / The Hardness of Metals by Tabor (1951)
10.1016/0040-6090(78)90337-1
10.1557/PROC-47-121
10.1063/1.1663054
6 Hu C. K. , Gupta D. and P. S. Ho, Proceedings of the 2nd International IEEE VLSI Multilevel Interconnect Conference, 1985, p. 187.
10.1088/0022-3727/18/2/007
14 Bravman J. C. (private communication).
10.1243/03093247V192135
10.1063/1.333027
10.1063/1.325084
10.1016/0040-6090(79)90550-9
12 Mclnerney E. J. and Flinn P. A. , International Reliability Physics Symposium, IEEE Electron Devices and Reliability Societies, 1982, p. 264. (10.1109/IRPS.1982.361940)
10.1557/JMR.1986.0601
{'key': 'S0884291400014734_ref009', 'first-page': '43', 'volume': '72', 'author': 'Stone', 'year': '1986', 'journal-title': 'Mater. Res. Soc. Proc.'} / Mater. Res. Soc. Proc. by Stone (1986)
10.1080/01418618308234914
10.1520/STP32951S
{'key': 'S0884291400014734_ref019', 'volume-title': 'Advances in Materials Research', 'volume': '4', 'author': 'Armstrong', 'year': '1970'} / Advances in Materials Research by Armstrong (1970)
10.1016/0040-6090(85)90298-6
5 Hieber H. and Simon T. , Proceedings of the International Reliability Physics Symposium, IEEE Electron Devices and Reliability Societies, 1986, p. 253. (10.1109/IRPS.1986.362142)
10.1080/01418618009365808
10.1016/0001-6160(77)90171-7

Dates

Type	When
Created	17 years, 11 months ago (Sept. 27, 2007, 5:09 a.m.)
Deposited	7 months, 1 week ago (Jan. 21, 2025, 1:55 a.m.)
Indexed	3 weeks, 5 days ago (Aug. 2, 2025, 12:52 a.m.)
Issued	38 years, 8 months ago (Dec. 1, 1986)
Published	38 years, 8 months ago (Dec. 1, 1986)
Published Online	14 years, 6 months ago (Jan. 31, 2011)
Published Print	38 years, 8 months ago (Dec. 1, 1986)

Funders 0

None

BibTeX

@article{Doerner_1986, title={Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques}, volume={1}, ISSN={2044-5326}, url={http://dx.doi.org/10.1557/jmr.1986.0845}, DOI={10.1557/jmr.1986.0845}, number={6}, journal={Journal of Materials Research}, publisher={Springer Science and Business Media LLC}, author={Doerner, M.F. and Gardner, D.S. and Nix, W.D.}, year={1986}, month=dec, pages={845–851} }

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