DOI: 10.1520/stp10979s. Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach

Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach

10.1520/stp10979s

Crossref book-chapter

ASTM International100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959

Mechanical Properties of Structural Films (381)

Abstract

Specimens have been developed to measure the strength and fracture toughness, of polycrystalline silicon and silicon carbide at the micron scale. The specimens have been fabricated using standard microelectromechanical systems (MEMS) processing techniques, and so have characteristic dimensions comparable to typical MEMS devices (notches, cracks and uncracked ligaments of several microns). They are fully integrated with simultaneously fabricated electrostatic actuators that are capable of providing sufficient force to ensure failure under monotonic loading. Thus the entire experiment takes place on-chip, eliminating the difficulties associated with attaching the specimen to an external loading source. Polycrystalline specimens containing cracks formed by indentation were associated with a microstructure independent average fracture toughness of 1.0 MPa√m. The strength of specimens containing micromachined blunt notches demonstrated a strong dependence on processing procedures and resulting surface roughness. Fractographic investigation suggests that this dependence is related to the size of processing-related flaws on the side surfaces of the films.

Bibliography

Ballarini, R., Kahn, H., Tayebi, N., & Heuer, A. (2001). Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach. Mechanical Properties of Structural Films, 37â51.

Authors 4

R Ballarini (first)
H Kahn (additional)
N Tayebi (additional)
AH Heuer (additional)

References 26 Referenced 14

Dates

Type	When
Created	17 years, 4 months ago (April 18, 2008, 2:09 p.m.)
Deposited	1 month, 4 weeks ago (June 25, 2025, 3:22 p.m.)
Indexed	1 month, 4 weeks ago (June 26, 2025, 12:09 a.m.)
Issued	24 years, 7 months ago (Jan. 1, 2001)
Published	24 years, 7 months ago (Jan. 1, 2001)
Published Print	24 years, 7 months ago (Jan. 1, 2001)

Funders 0

None

BibTeX

@inbook{Ballarini_2001, title={Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach}, ISBN={9780803154582}, url={http://dx.doi.org/10.1520/stp10979s}, DOI={10.1520/stp10979s}, booktitle={Mechanical Properties of Structural Films}, publisher={ASTM International100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959}, author={Ballarini, R and Kahn, H and Tayebi, N and Heuer, AH}, year={2001}, month=jan, pages={37–51} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        6,
        26
      ]
    ],
    "date-time": "2025-06-26T04:09:04Z",
    "timestamp": 1750910944379,
    "version": "3.41.0"
  },
  "reference-count": 26,
  "publisher": "ASTM International100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959",
  "isbn-type": [
    {
      "type": "print",
      "value": "0803128894"
    },
    {
      "type": "print",
      "value": "9780803128897"
    },
    {
      "type": "electronic",
      "value": "9780803154582"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2001,
        1,
        1
      ]
    ]
  },
  "abstract": "<jats:p>Specimens have been developed to measure the strength and fracture toughness, of polycrystalline silicon and silicon carbide at the micron scale. The specimens have been fabricated using standard microelectromechanical systems (MEMS) processing techniques, and so have characteristic dimensions comparable to typical MEMS devices (notches, cracks and uncracked ligaments of several microns). They are fully integrated with simultaneously fabricated electrostatic actuators that are capable of providing sufficient force to ensure failure under monotonic loading. Thus the entire experiment takes place on-chip, eliminating the difficulties associated with attaching the specimen to an external loading source. Polycrystalline specimens containing cracks formed by indentation were associated with a microstructure independent average fracture toughness of 1.0 MPa\u221am. The strength of specimens containing micromachined blunt notches demonstrated a strong dependence on processing procedures and resulting surface roughness. Fractographic investigation suggests that this dependence is related to the size of processing-related flaws on the side surfaces of the films.</jats:p>",
  "DOI": "10.1520/stp10979s",
  "type": "book-chapter",
  "created": {
    "date-parts": [
      [
        2008,
        4,
        18
      ]
    ],
    "date-time": "2008-04-18T18:09:47Z",
    "timestamp": 1208542187000
  },
  "page": "37-51",
  "source": "Crossref",
  "is-referenced-by-count": 14,
  "title": "Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach",
  "prefix": "10.1520",
  "author": [
    {
      "given": "R",
      "family": "Ballarini",
      "sequence": "first",
      "affiliation": [
        {
          "name": "Case Western Reserve University 1 Professor of Civil Engineering , , Cleveland, Ohio44106"
        }
      ]
    },
    {
      "given": "H",
      "family": "Kahn",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "2Researcher, Department of Materials Science and Engineering"
        }
      ]
    },
    {
      "given": "N",
      "family": "Tayebi",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "3Graduate student, Department of Mechanical and Aerospace Engineering"
        }
      ]
    },
    {
      "given": "AH",
      "family": "Heuer",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "4Kyocera Professor of Materials Science and Engineering"
        }
      ]
    }
  ],
  "member": "381",
  "reference": [
    {
      "key": "2025062515140392400_p37_c1",
      "doi-asserted-by": "crossref",
      "unstructured": "Ballarini, R., \u201cRecent Developments in Experimental and Theoretical Studies of the Mechanical Behavior of Polycrystalline Silicon for Microelectromechanical Systems,\u201d Materials Research Society Symposium Proceedings\u20080272-9172, Vol. 546, 1999, pp. 3\u201314.",
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    },
    {
      "key": "2025062515140392400_p37_c2",
      "doi-asserted-by": "crossref",
      "unstructured": "Kahn, H., Tayebi, N., Ballarini, R., Mullen, R. L., and Heuer, A. H., \u201cFracture Toughness of Polysilicon MEMS Devices,\u201d Sensors and Actuators\u20080250-6874, Vol. 82, 2000, pp. 274\u2013280.",
      "DOI": "10.1016/S0924-4247(99)00366-0"
    },
    {
      "key": "2025062515140392400_p37_c3",
      "doi-asserted-by": "crossref",
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    {
      "key": "2025062515140392400_p37_c6",
      "doi-asserted-by": "crossref",
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      "doi-asserted-by": "crossref",
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      "unstructured": "Connally, J. A. and Brown, S. B., \u201cNanosystem Measures Ultraslow Crack Growth,\u201d Materials Research Society Bulletin, 061993, p. 4."
    },
    {
      "key": "2025062515140392400_p37_c10",
      "doi-asserted-by": "crossref",
      "unstructured": "Connally, J. A. and Brown, S. B., \u201cMicromechanical Fatigue Testing,\u201d Experimental Mechanics, 061993, pp. 81\u201390.",
      "DOI": "10.1007/BF02322482"
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    {
      "key": "2025062515140392400_p37_c11",
      "doi-asserted-by": "crossref",
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    },
    {
      "key": "2025062515140392400_p37_c12",
      "doi-asserted-by": "crossref",
      "unstructured": "Kahn, H., Ballarini, R., Mullen, R. L., and Heuer, A. H., \u201cFracture Toughness of Polysilicon MEMS Devices,\u201d Proceedings, Royal Society of London, A\u2008455, 1999, pp. 3807\u20133823.",
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    },
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      "doi-asserted-by": "crossref",
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    },
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      "key": "2025062515140392400_p37_c16",
      "doi-asserted-by": "crossref",
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    {
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    {
      "key": "2025062515140392400_p37_c23",
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      "unstructured": "Yang, J., Kahn, H., He, A. Q., Phillips, S. M., and Heuer, A. H., \u201cAn Improved Technique for Producing Zero Stress LPCVD Polysilicon Films: the MultiPoly\u2122 Process,\u201d Journal of Microelectromechanical Systems\u20081057-715710.1109/84.896770, Vol. 9, 2000, pp. 485\u2013494.",
      "DOI": "10.1109/84.896770"
    },
    {
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    },
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      "key": "2025062515140392400_p37_c26",
      "doi-asserted-by": "crossref",
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    }
  ],
  "container-title": "Mechanical Properties of Structural Films",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://dl.astm.org/stps/book/chapter-pdf/24394/10_1520_stp10979s.pdf",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2025,
        6,
        25
      ]
    ],
    "date-time": "2025-06-25T19:22:09Z",
    "timestamp": 1750879329000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://dl.astm.org/stps/book/112/chapter/51933/Effects-of-Microstructure-on-the-Strength-and"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2001,
        1,
        1
      ]
    ]
  },
  "ISBN": [
    "0803128894",
    "9780803128897",
    "9780803154582"
  ],
  "references-count": 26,
  "URL": "http://dx.doi.org/10.1520/STP10979S",
  "relation": {},
  "subject": [],
  "published": {
    "date-parts": [
      [
        2001,
        1,
        1
      ]
    ]
  }
}