DOI: 10.1520/jte10895j. Fatigue Behavior of Solders Used in Flip-Chip Technology

Fatigue Behavior of Solders Used in Flip-Chip Technology

10.1520/jte10895j

Crossref journal-article

ASTM International

Journal of Testing and Evaluation (381)

Abstract

Abstract This paper surveys the mechanical fatigue behavior of 5/95 Sn/Pb solder and solder with copper, silver and palladium impurities at different temperatures and on-off cycling frequencies. Presence of copper in 5/95 Sn/Pb creates hard and relatively brittle intermetallics which also significantly decrease the fatigue life of solder. The fatigue cracks were observed to propagate through grain boundaries, although some slip striations were observed within individual grains. There is a significant decrease in the fatigue life of 5/95 Sn/Pb in the temperature range of 85 C to 150 C. The fatigue life of solder decreases with a decrease in cycling frequency. Results have shown that the frequency exponent is equal to ⅕. Cyclic strain softening was observed in the specimens which were tested under constant total strain control conditions.

Bibliography

Rathore, H., Yih, R., & Edenfeld, A. (1973). Fatigue Behavior of Solders Used in Flip-Chip Technology. Journal of Testing and Evaluation, 1(2), 170â178.

Authors 3

HS Rathore (first)
RC Yih (additional)
AR Edenfeld (additional)

References 16 Referenced 21

Moore, H. F., Betty, B. B., and Dollins, C. W., University of Illinois, Bulletin No. 272, 05021935.
Moore, H. F., Betty, B. B., and Dollins, C. W., University of Illinois, Bulletin No. 306, 19081938.
Moore, H. F. and Dollins, C. W., University of Illinois, Bulletin No. 347, 19101943.
{'volume-title': 'Proceedings', 'year': '1951', 'author': 'Gohn', 'key': '2025062719433861800_c4'} / Proceedings by Gohn (1951)
{'volume-title': 'Proceedings', 'year': '1951', 'author': 'Eckel', 'key': '2025062719433861800_c5'} / Proceedings by Eckel (1951)
Babington, W. , quoted in Ref. .
{'key': '2025062719433861800_c7', 'volume': '65', 'author': 'Hickernell', 'year': '1946', 'journal-title': 'Transactions'} / Transactions by Hickernell (1946)
{'key': '2025062719433861800_c8', 'volume': '29', 'author': 'Tsuda', 'year': '1965', 'journal-title': 'Nippon Kinzoku Gakkai-Si'} / Nippon Kinzoku Gakkai-Si by Tsuda (1965)
{'key': '2025062719433861800_c9', 'volume': '12', 'author': 'Snowden', 'year': '1966', 'journal-title': 'Philosophical Magazine', 'ISSN': 'https://id.crossref.org/issn/1478-6435', 'issn-type': 'print'} / Philosophical Magazine by Snowden (1966)
10.1080/14786436408224222 / Philosophical Magazine by Snowden (1964)
{'key': '2025062719433861800_c11', 'volume': '1', 'author': 'Coffin', 'year': '1962', 'journal-title': 'Applied Materials Research', 'ISSN': 'https://id.crossref.org/issn/0570-4847', 'issn-type': 'print'} / Applied Materials Research by Coffin (1962)
{'key': '2025062719433861800_c12', 'article-title': 'High Temperature Low Cycle Fatigue', 'volume-title': 'Spring Meeting of SESA', 'author': 'Coffin', 'year': '1967'} / Spring Meeting of SESA / High Temperature Low Cycle Fatigue by Coffin (1967)
10.1007/BF02321056 / Experimental Mechanics by Manson (1965)
10.1147/rd.133.0266 / IBM Journal of Research and Development by Norris (1969)
Rathore, H. S., Yih, R. C. and Edenfeld, A. R., “Mechanical Properties of 5/95 Sn/Pb Solder and Solder Containing Impurities,” IBM Technical Report TR 22.1009, 051970.
{'volume-title': 'The Properties of Soft Solders and Soldered Joints', 'year': '1948', 'author': 'McKeown', 'key': '2025062719433861800_c16'} / The Properties of Soft Solders and Soldered Joints by McKeown (1948)

Dates

Type	When
Created	16 years, 5 months ago (Feb. 27, 2009, 10 a.m.)
Deposited	1 month, 3 weeks ago (June 27, 2025, 7:43 p.m.)
Indexed	1 month, 3 weeks ago (June 27, 2025, 8:10 p.m.)
Issued	52 years, 5 months ago (March 1, 1973)
Published	52 years, 5 months ago (March 1, 1973)
Published Print	52 years, 5 months ago (March 1, 1973)

Funders 0

None

BibTeX

@article{Rathore_1973, title={Fatigue Behavior of Solders Used in Flip-Chip Technology}, volume={1}, ISSN={0090-3973}, url={http://dx.doi.org/10.1520/jte10895j}, DOI={10.1520/jte10895j}, number={2}, journal={Journal of Testing and Evaluation}, publisher={ASTM International}, author={Rathore, HS and Yih, RC and Edenfeld, AR}, year={1973}, month=mar, pages={170–178} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        6,
        28
      ]
    ],
    "date-time": "2025-06-28T00:10:07Z",
    "timestamp": 1751069407889,
    "version": "3.41.0"
  },
  "reference-count": 16,
  "publisher": "ASTM International",
  "issue": "2",
  "content-domain": {
    "domain": [
      "asmedigitalcollection.asme.org"
    ],
    "crossmark-restriction": true
  },
  "published-print": {
    "date-parts": [
      [
        1973,
        3,
        1
      ]
    ]
  },
  "abstract": "<jats:title>Abstract</jats:title>\n               <jats:p>This paper surveys the mechanical fatigue behavior of 5/95 Sn/Pb solder and solder with copper, silver and palladium impurities at different temperatures and on-off cycling frequencies. Presence of copper in 5/95 Sn/Pb creates hard and relatively brittle intermetallics which also significantly decrease the fatigue life of solder. The fatigue cracks were observed to propagate through grain boundaries, although some slip striations were observed within individual grains. There is a significant decrease in the fatigue life of 5/95 Sn/Pb in the temperature range of 85 C to 150 C. The fatigue life of solder decreases with a decrease in cycling frequency. Results have shown that the frequency exponent is equal to \u2155. Cyclic strain softening was observed in the specimens which were tested under constant total strain control conditions.</jats:p>",
  "DOI": "10.1520/jte10895j",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2009,
        2,
        27
      ]
    ],
    "date-time": "2009-02-27T15:00:03Z",
    "timestamp": 1235746803000
  },
  "page": "170-178",
  "update-policy": "https://doi.org/10.1115/crossmarkpolicy-asme",
  "source": "Crossref",
  "is-referenced-by-count": 21,
  "title": "Fatigue Behavior of Solders Used in Flip-Chip Technology",
  "prefix": "10.1520",
  "volume": "1",
  "author": [
    {
      "given": "HS",
      "family": "Rathore",
      "sequence": "first",
      "affiliation": [
        {
          "name": "International Business Machines, System Products Division 1 Senior associate engineer, development engineer, and staff engineer , respectively, , East Fishkill, New York ."
        }
      ]
    },
    {
      "given": "RC",
      "family": "Yih",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "International Business Machines, System Products Division 1 Senior associate engineer, development engineer, and staff engineer , respectively, , East Fishkill, New York ."
        }
      ]
    },
    {
      "given": "AR",
      "family": "Edenfeld",
      "sequence": "additional",
      "affiliation": [
        {
          "name": "International Business Machines, System Products Division 1 Senior associate engineer, development engineer, and staff engineer , respectively, , East Fishkill, New York ."
        }
      ]
    }
  ],
  "member": "381",
  "reference": [
    {
      "key": "2025062719433861800_c1",
      "unstructured": "Moore, H. F., Betty, B. B., and Dollins, C. W., University of Illinois, Bulletin No. 272, 05021935."
    },
    {
      "key": "2025062719433861800_c2",
      "unstructured": "Moore, H. F., Betty, B. B., and Dollins, C. W., University of Illinois, Bulletin No. 306, 19081938."
    },
    {
      "key": "2025062719433861800_c3",
      "unstructured": "Moore, H. F. and Dollins, C. W., University of Illinois, Bulletin No. 347, 19101943."
    },
    {
      "volume-title": "Proceedings",
      "year": "1951",
      "author": "Gohn",
      "key": "2025062719433861800_c4"
    },
    {
      "volume-title": "Proceedings",
      "year": "1951",
      "author": "Eckel",
      "key": "2025062719433861800_c5"
    },
    {
      "key": "2025062719433861800_c6",
      "unstructured": "Babington, W.\n          , quoted in Ref. ."
    },
    {
      "key": "2025062719433861800_c7",
      "volume": "65",
      "author": "Hickernell",
      "year": "1946",
      "journal-title": "Transactions"
    },
    {
      "key": "2025062719433861800_c8",
      "volume": "29",
      "author": "Tsuda",
      "year": "1965",
      "journal-title": "Nippon Kinzoku Gakkai-Si"
    },
    {
      "key": "2025062719433861800_c9",
      "volume": "12",
      "author": "Snowden",
      "year": "1966",
      "journal-title": "Philosophical Magazine",
      "ISSN": "https://id.crossref.org/issn/1478-6435",
      "issn-type": "print"
    },
    {
      "key": "2025062719433861800_c10",
      "doi-asserted-by": "crossref",
      "DOI": "10.1080/14786436408224222",
      "volume": "10",
      "author": "Snowden",
      "year": "1964",
      "journal-title": "Philosophical Magazine",
      "ISSN": "https://id.crossref.org/issn/1478-6435",
      "issn-type": "print"
    },
    {
      "key": "2025062719433861800_c11",
      "volume": "1",
      "author": "Coffin",
      "year": "1962",
      "journal-title": "Applied Materials Research",
      "ISSN": "https://id.crossref.org/issn/0570-4847",
      "issn-type": "print"
    },
    {
      "key": "2025062719433861800_c12",
      "article-title": "High Temperature Low Cycle Fatigue",
      "volume-title": "Spring Meeting of SESA",
      "author": "Coffin",
      "year": "1967"
    },
    {
      "key": "2025062719433861800_c13",
      "doi-asserted-by": "crossref",
      "first-page": "193",
      "DOI": "10.1007/BF02321056",
      "volume": "5",
      "author": "Manson",
      "year": "1965",
      "journal-title": "Experimental Mechanics"
    },
    {
      "key": "2025062719433861800_c14",
      "doi-asserted-by": "crossref",
      "DOI": "10.1147/rd.133.0266",
      "volume": "13",
      "author": "Norris",
      "year": "1969",
      "journal-title": "IBM Journal of Research and Development",
      "ISSN": "https://id.crossref.org/issn/0018-8646",
      "issn-type": "print"
    },
    {
      "key": "2025062719433861800_c15",
      "unstructured": "Rathore, H. S., Yih, R. C. and Edenfeld, A. R., \u201cMechanical Properties of 5/95 Sn/Pb Solder and Solder Containing Impurities,\u201d IBM Technical Report TR 22.1009, 051970."
    },
    {
      "volume-title": "The Properties of Soft Solders and Soldered Joints",
      "year": "1948",
      "author": "McKeown",
      "key": "2025062719433861800_c16"
    }
  ],
  "container-title": "Journal of Testing and Evaluation",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "https://dl.astm.org/jte/article-pdf/1/2/170/129135/10_1520_jte10895j.pdf",
      "content-type": "application/pdf",
      "content-version": "vor",
      "intended-application": "syndication"
    },
    {
      "URL": "https://dl.astm.org/jte/article-pdf/1/2/170/129135/10_1520_jte10895j.pdf",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2025,
        6,
        27
      ]
    ],
    "date-time": "2025-06-27T23:43:45Z",
    "timestamp": 1751067825000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://dl.astm.org/jte/article/1/2/170/17409/Fatigue-Behavior-of-Solders-Used-in-Flip-Chip"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1973,
        3,
        1
      ]
    ]
  },
  "references-count": 16,
  "journal-issue": {
    "issue": "2",
    "published-print": {
      "date-parts": [
        [
          1973,
          3,
          1
        ]
      ]
    }
  },
  "URL": "http://dx.doi.org/10.1520/JTE10895J",
  "relation": {},
  "ISSN": [
    "0090-3973"
  ],
  "subject": [],
  "published": {
    "date-parts": [
      [
        1973,
        3,
        1
      ]
    ]
  }
}