DOI: 10.1179/cmq.1995.34.3.287. Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films

Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films

10.1179/cmq.1995.34.3.287

Crossref journal-article

Informa UK Limited

Canadian Metallurgical Quarterly (301)

Bibliography

Lee, K. T., Szpunar, J. A., Morawiec, A., Knorr, D. B., & Rodbell, K. P. (1995). Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films. Canadian Metallurgical Quarterly, 34(3), 287â292.

Authors 5

K. T. Lee (first)
J. A. Szpunar (additional)
A. Morawiec (additional)
D. B. Knorr (additional)
K. P. Rodbell (additional)

References 20 Referenced 15

10.1063/1.1659233
E. Nagasawa, H. Okabayashi, T. Nozaki and K. Nikawa. Proceedings of The 171h Reliability Physics Symposium, p. 64.IEEE. New York, 1979. (10.1109/IRPS.1979.362872)
10.1557/PROC-265-107
10.1557/PROC-280-523
10.1063/1.101085
10.1557/PROC-265-113
10.4028/www.scientific.net/MSF.46.25
10.1016/0956-716X(91)90376-C
10.1016/0956-7151(92)90088-V
10.1016/0040-6090(93)90186-S
{'volume-title': 'J. Vac. Sci. Tech. A6, 9', 'year': '1988', 'author': 'Niu S. N.', 'key': 'CIT0011'} / J. Vac. Sci. Tech. A6, 9 by Niu S. N. (1988)
10.1016/0001-6160(66)90168-4
10.1016/0956-7151(93)90097-C
10.1557/PROC-309-75
10.1016/0001-6160(75)90100-5
10.1016/0956-7151(93)90075-4
10.1016/0956-7151(93)90076-5
H. Toyoda, T. Kawanoue, M. Hasunuma, H. Kaneko and M. Miyauchi, 32nd Annual Proceedings Reliability Physics, p. 178. IEEE/IRPS, NY, 1994. (10.1109/RELPHY.1994.307839)
{'key': 'CIT0019', 'first-page': '142', 'volume': '16', 'author': 'Gleiter H.', 'year': '1972', 'journal-title': 'Progr. Mater. Sci'} / Progr. Mater. Sci by Gleiter H. (1972)
10.1007/BF02648378

Dates

Type	When
Created	11 years, 7 months ago (Jan. 9, 2014, 12:39 p.m.)
Deposited	3 months, 2 weeks ago (May 1, 2025, 8:41 a.m.)
Indexed	1 month, 4 weeks ago (June 24, 2025, 7:30 a.m.)
Issued	30 years, 1 month ago (July 1, 1995)
Published	30 years, 1 month ago (July 1, 1995)
Published Online	12 years, 1 month ago (July 18, 2013)
Published Print	30 years, 1 month ago (July 1, 1995)

Funders 0

None

BibTeX

@article{Lee_1995, title={Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films}, volume={34}, ISSN={1879-1395}, url={http://dx.doi.org/10.1179/cmq.1995.34.3.287}, DOI={10.1179/cmq.1995.34.3.287}, number={3}, journal={Canadian Metallurgical Quarterly}, publisher={Informa UK Limited}, author={Lee, K. T. and Szpunar, J. A. and Morawiec, A. and Knorr, D. B. and Rodbell, K. P.}, year={1995}, month=jul, pages={287–292} }

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