Crossref journal-article
Informa UK Limited
Journal of Adhesion Science and Technology (301)
Bibliography

Iwamori, S., Miyashita, T., Fukuda, S., Nozaki, S., Sudoh, K., & Fukuda, N. (1997). Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment. Journal of Adhesion Science and Technology, 11(6), 783–795.

Authors 6
  1. Satoru Iwamori (first)
  2. Takehiro Miyashita (additional)
  3. Shin Fukuda (additional)
  4. Shouhei Nozaki (additional)
  5. Kazufuyu Sudoh (additional)
  6. Nobuhiro Fukuda (additional)
References 15 Referenced 16
  1. {'key': 'CIT0001', 'first-page': '739', 'volume': '3', 'author': 'Ho P. S.', 'year': '1985', 'journal-title': 'J. Vac. Sci. Technol.'} / J. Vac. Sci. Technol. by Ho P. S. (1985)
  2. 10.1116/1.572564 / J. Vac. Sci. Technol. by Chou N. J. (1984)
  3. 10.1116/1.573449 / J. Vac. Sci. Technol. by Sanda P. N. (1986)
  4. 10.1016/0169-4332(91)90026-G / Appl. Surface Sci. by Perstin A. J. (1991)
  5. 10.1116/1.577228 / J. Vac. Sci. Technol. by Pappas D. L. (1991)
  6. 10.1116/1.575468 / J. Vac. Sci. Technol. by Chambers S. A. (1988)
  7. 10.1116/1.577157 / J. Vac. Sci. Technol. by Shih D. Y. (1991)
  8. 10.1116/1.576045 / J. Vac. Sci. Technol. by Burrell M. C. (1990)
  9. 10.1116/1.576933 / J. Vac. Sci. Technol. by Chambers S. A. (1990)
  10. 10.1163/156856187X00337 / J. Adhesion Sci. Technol. by Kim Y. H. (1987)
  11. 10.1007/BF00572382 / Fresenius Z. Anal. Chem. by Horn K. (1989)
  12. 10.1080/00218468308073228 / J. Adhesion by Chan C. M. (1983)
  13. 10.1116/1.579161 / J. Vac. Sci. Technol. by Chenite A. (1994)
  14. {'key': 'CIT0014', 'volume-title': 'Practical Surface Analysis', 'author': 'Briggs D.', 'year': '1988'} / Practical Surface Analysis by Briggs D. (1988)
  15. {'key': 'CIT0015', 'volume-title': 'Handbook of X-ray Photoelectron Spectroscopy', 'author': 'Wagner C. D.', 'year': '1979'} / Handbook of X-ray Photoelectron Spectroscopy by Wagner C. D. (1979)
Dates
Type When
Created 17 years, 4 months ago (April 7, 2008, 11:40 a.m.)
Deposited 8 years, 2 months ago (June 17, 2017, 10:24 p.m.)
Indexed 1 year, 9 months ago (Oct. 29, 2023, 9:20 a.m.)
Issued 28 years, 7 months ago (Jan. 1, 1997)
Published 28 years, 7 months ago (Jan. 1, 1997)
Published Print 28 years, 7 months ago (Jan. 1, 1997)
Funders 0

None

@article{Iwamori_1997, title={Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment}, volume={11}, ISSN={1568-5616}, url={http://dx.doi.org/10.1163/156856197x00912}, DOI={10.1163/156856197x00912}, number={6}, journal={Journal of Adhesion Science and Technology}, publisher={Informa UK Limited}, author={Iwamori, Satoru and Miyashita, Takehiro and Fukuda, Shin and Nozaki, Shouhei and Sudoh, Kazufuyu and Fukuda, Nobuhiro}, year={1997}, month=jan, pages={783–795} }