Crossref journal-article
The Electrochemical Society
Journal of The Electrochemical Society (77)
Bibliography

Chen, C.-W., Chen, J. S., & Jeng, J.-S. (2008). Improvement on the Diffusion Barrier Performance of Reactively Sputtered Ru–N Film by Incorporation of Ta. Journal of The Electrochemical Society, 155(6), H438.

Authors 3
  1. Chun-Wei Chen (first)
  2. J. S. Chen (additional)
  3. Jiann-Shing Jeng (additional)
References 20 Referenced 30
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Dates
Type When
Created 17 years, 4 months ago (May 4, 2008, 4:09 a.m.)
Deposited 5 years, 7 months ago (Jan. 13, 2020, 8:39 a.m.)
Indexed 1 year, 3 months ago (June 4, 2024, 12:27 a.m.)
Issued 17 years, 8 months ago (Jan. 1, 2008)
Published 17 years, 8 months ago (Jan. 1, 2008)
Published Print 17 years, 8 months ago (Jan. 1, 2008)
Funders 0

None

@article{Chen_2008, title={Improvement on the Diffusion Barrier Performance of Reactively Sputtered Ru–N Film by Incorporation of Ta}, volume={155}, ISSN={0013-4651}, url={http://dx.doi.org/10.1149/1.2905749}, DOI={10.1149/1.2905749}, number={6}, journal={Journal of The Electrochemical Society}, publisher={The Electrochemical Society}, author={Chen, Chun-Wei and Chen, J. S. and Jeng, Jiann-Shing}, year={2008}, pages={H438} }