Crossref journal-article
The Electrochemical Society
Journal of The Electrochemical Society (77)
Bibliography

Shim, K.-C., Lee, H.-B., Kwon, O.-K., Park, H.-S., Koh, W., & Kang, S.-W. (2002). Bottom-up Filling of Submicrometer Features in Catalyst-Enhanced Chemical Vapor Deposition of Copper. Journal of The Electrochemical Society, 149(2), G109.

Authors 6
  1. Kew-Chan Shim (first)
  2. Hyun-Bae Lee (additional)
  3. Oh-Kyum Kwon (additional)
  4. Hyung-Sang Park (additional)
  5. Wonyong Koh (additional)
  6. Sang-Won Kang (additional)
References 8 Referenced 43
  1. 10.1016/0040-6090(93)90680-N / Thin Solid Films by Murarka (1993)
  2. 10.1149/1.2085434 / J. Electrochem. Soc. by Kaufman (1991)
  3. 10.1147/rd.425.0567 / IBM J. Res. Dev. by Andricacos (1998)
  4. 10.1149/1.1838941 / J. Electrochem. Soc. by Chae (1998)
  5. 10.1021/cm00022a009 / Chem. Mater. by Shin (1992)
  6. 10.1103/PhysRevB.51.14806 / Phys. Rev. B by van der Vegt (1995)
  7. 10.1021/cm990805+ / Chem. Mater. by Hwang (2000)
  8. 10.1021/j100200a059 / J. Phys. Chem. by Lin (1992)
Dates
Type When
Created 23 years ago (July 26, 2002, 10:13 a.m.)
Deposited 5 years, 7 months ago (Jan. 10, 2020, 4:46 p.m.)
Indexed 2 months, 3 weeks ago (June 2, 2025, 8:07 a.m.)
Issued 23 years, 7 months ago (Jan. 1, 2002)
Published 23 years, 7 months ago (Jan. 1, 2002)
Published Print 23 years, 7 months ago (Jan. 1, 2002)
Funders 0

None

@article{Shim_2002, title={Bottom-up Filling of Submicrometer Features in Catalyst-Enhanced Chemical Vapor Deposition of Copper}, volume={149}, ISSN={0013-4651}, url={http://dx.doi.org/10.1149/1.1430230}, DOI={10.1149/1.1430230}, number={2}, journal={Journal of The Electrochemical Society}, publisher={The Electrochemical Society}, author={Shim, Kew-Chan and Lee, Hyun-Bae and Kwon, Oh-Kyum and Park, Hyung-Sang and Koh, Wonyong and Kang, Sang-Won}, year={2002}, pages={G109} }