DOI: 10.1143/jjap.43.7427. Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation

Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation

10.1143/jjap.43.7427

Crossref journal-article

IOP Publishing

Japanese Journal of Applied Physics (266)

Bibliography

Kim, S.-K., Yoon, P.-W., Paik, U., Katoh, T., & Park, J.-G. (2004). Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation. Japanese Journal of Applied Physics, 43(11A), 7427â7433.

Authors 5

Sang-Kyun Kim (first)
Phil-Won Yoon (additional)
Ungyu Paik (additional)
Takeo Katoh (additional)
Jea-Gun Park (additional)

References 0 Referenced 21

None

Dates

Type	When
Created	20 years, 6 months ago (Feb. 10, 2005, 7:19 a.m.)
Deposited	5 years, 3 months ago (May 31, 2020, 7:02 p.m.)
Indexed	1 year ago (Aug. 8, 2024, 7:12 a.m.)
Issued	20 years, 9 months ago (Nov. 10, 2004)
Published	20 years, 9 months ago (Nov. 10, 2004)
Published Online	20 years, 9 months ago (Nov. 10, 2004)

Funders 0

None

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