DOI: 10.1143/jjap.42.l1044. Device Transfer Technology by Backside Etching (DTBE) for Poly-Si Thin-Film Transistors on Glass/Plastic Substrate

Device Transfer Technology by Backside Etching (DTBE) for Poly-Si Thin-Film Transistors on Glass/Plastic Substrate

10.1143/jjap.42.l1044

Crossref journal-article

IOP Publishing

Japanese Journal of Applied Physics (266)

Bibliography

Wang, S.-C., Yeh, C.-F., Huang, C.-K., & Dai, Y.-T. (2003). Device Transfer Technology by Backside Etching (DTBE) for Poly-Si Thin-Film Transistors on Glass/Plastic Substrate. Japanese Journal of Applied Physics, 42(Part 2, No.9A/B), L1044âL1046.

Authors 4

Shuo-Cheng Wang (first)
Ching-Fa Yeh (additional)
Chien-Kai Huang (additional)
Yuan-Tung Dai (additional)

References 0 Referenced 16

None

Dates

Type	When
Created	21 years, 8 months ago (Dec. 26, 2003, 7:53 a.m.)
Deposited	5 years, 2 months ago (May 31, 2020, 6:40 p.m.)
Indexed	2 months, 2 weeks ago (June 11, 2025, 5:28 a.m.)
Issued	21 years, 11 months ago (Sept. 15, 2003)
Published	21 years, 11 months ago (Sept. 15, 2003)
Published Print	21 years, 11 months ago (Sept. 15, 2003)

Funders 0

None

BibTeX

@article{Wang_2003, title={Device Transfer Technology by Backside Etching (DTBE) for Poly-Si Thin-Film Transistors on Glass/Plastic Substrate}, volume={42}, ISSN={0021-4922}, url={http://dx.doi.org/10.1143/jjap.42.l1044}, DOI={10.1143/jjap.42.l1044}, number={Part 2, No.9A/B}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Wang, Shuo-Cheng and Yeh, Ching-Fa and Huang, Chien-Kai and Dai, Yuan-Tung}, year={2003}, month=sep, pages={L1044–L1046} }

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