DOI: 10.1143/jjap.41.4366. Fluidic Self-Assembly of Semiconductor Devices: A Promising New Method of Mass-Producing Flexible Circuitry

Fluidic Self-Assembly of Semiconductor Devices: A Promising New Method of Mass-Producing Flexible Circuitry

10.1143/jjap.41.4366

Crossref journal-article

IOP Publishing

Japanese Journal of Applied Physics (266)

Bibliography

Snyder, E. J., Chideme, J., & Craig, G. S. W. (2002). Fluidic Self-Assembly of Semiconductor Devices: A Promising New Method of Mass-Producing Flexible Circuitry. Japanese Journal of Applied Physics, 41(Part 1, No. 6B), 4366â4369.

Authors 3

Eric J. Snyder (first)
John Chideme (additional)
Gordon S. W. Craig (additional)

References 0 Referenced 22

None

Dates

Type	When
Created	22 years, 11 months ago (Oct. 1, 2002, 5:11 p.m.)
Deposited	5 years, 3 months ago (May 31, 2020, 7:29 p.m.)
Indexed	11 months, 2 weeks ago (Sept. 15, 2024, 6:37 p.m.)
Issued	23 years, 2 months ago (June 30, 2002)
Published	23 years, 2 months ago (June 30, 2002)
Published Print	23 years, 2 months ago (June 30, 2002)

Funders 0

None

BibTeX

@article{Snyder_2002, title={Fluidic Self-Assembly of Semiconductor Devices: A Promising New Method of Mass-Producing Flexible Circuitry}, volume={41}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.41.4366}, DOI={10.1143/jjap.41.4366}, number={Part 1, No. 6B}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Snyder, Eric J. and Chideme, John and Craig, Gordon S. W.}, year={2002}, month=jun, pages={4366–4369} }

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