Abstract
Low-temperature growth of polycrystalline silicon films using SiCl4/H2 in a hot-wire chemical vapor deposition (HWCVD) reactor is reported here. Slightly (100) oriented polycrystalline silicon film with a crystalline fraction of 97% has been deposited at a hot wire temperature of 1900°C and a substrate temperature of 320°C. The average grain size of the film is 0.1 µm with a thickness of 0.5 µm. (110) Preferentially orientated silicon film with a 97% crystalline fraction is also deposited at a hot wire temperature of 1700°C and a substrate temperature of 290°C. A nanocrystalline film with a 57% crystalline fraction is formed when the substrate temperature is lowered to 150°C. The roles of Cl and H radicals in the formation of crystalline silicon films are discussed.
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Dates
Type | When |
---|---|
Created | 22 years, 10 months ago (Oct. 1, 2002, 4:34 p.m.) |
Deposited | 2 years, 8 months ago (Dec. 19, 2022, 12:30 p.m.) |
Indexed | 6 months ago (Feb. 21, 2025, 5:33 a.m.) |
Issued | 23 years, 9 months ago (Nov. 1, 2001) |
Published | 23 years, 9 months ago (Nov. 1, 2001) |
Published Print | 23 years, 9 months ago (Nov. 1, 2001) |
@article{Wong_2001, title={Low Temperature Growth of Polycrystalline Silicon Films by Hot-Wire Chemical Vapor Deposition Using SiCl4/H2 Gases}, volume={40}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.40.l1207}, DOI={10.1143/jjap.40.l1207}, number={11B}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Wong, Te-Chi and Wu, Jih-Jen}, year={2001}, month=nov, pages={L1207} }