Crossref journal-article
IOP Publishing
Japanese Journal of Applied Physics (266)
Abstract

Polymer-like organic thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using the para-xylene precursor. The effect of the plasma power on the dielectric constant and thermal stability was significant. As the plasma power was increased from 5 W to 60 W, the relative dielectric constant increased from 2.70 to 3.21. The film deposited at a higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 450°C. All the deposited films were insulating under an applied field of ≤1 MV/cm.

Bibliography

Chun Quan, Y., Jongryang Joo, J. J., & Donggeun Jung, D. J. (1999). Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization. Japanese Journal of Applied Physics, 38(3R), 1356.

Authors 3
  1. Yong Chun Quan (first)
  2. Jongryang Joo Jongryang Joo (additional)
  3. Donggeun Jung Donggeun Jung (additional)
References 9 Referenced 33
  1. {'key': ''}
  2. 10.1063/1.120703 / Appl. Phys. Lett. (1998)
  3. 10.1557/JMR.1994.3125 / J. Mater. Res. (1994)
  4. 10.1116/1.578295 / J. Vac. Sci. Technol. A (1993)
  5. 10.1063/1.118935 / Appl. Phys. Lett. (1997)
  6. 10.1016/S0379-6779(97)80001-X / Synth. Met. (1996)
  7. 10.1143/JJAP.37.L406 / Jpn. J. Appl. Phys. (1998)
  8. {'key': ''}
  9. 10.1143/JJAP.37.4894 / Jpn. J. Appl. Phys. (1998)
Dates
Type When
Created 22 years, 11 months ago (Oct. 1, 2002, 6:51 p.m.)
Deposited 2 years, 8 months ago (Dec. 14, 2022, 12:04 p.m.)
Indexed 6 months, 2 weeks ago (Feb. 21, 2025, 5:33 a.m.)
Issued 26 years, 6 months ago (March 1, 1999)
Published 26 years, 6 months ago (March 1, 1999)
Published Print 26 years, 6 months ago (March 1, 1999)
Funders 0

None

@article{Chun_Quan_1999, title={Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization}, volume={38}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.38.1356}, DOI={10.1143/jjap.38.1356}, number={3R}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Chun Quan, Yong and Jongryang Joo, Jongryang Joo and Donggeun Jung, Donggeun Jung}, year={1999}, month=mar, pages={1356} }