Abstract
Polymer-like organic thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using the para-xylene precursor. The effect of the plasma power on the dielectric constant and thermal stability was significant. As the plasma power was increased from 5 W to 60 W, the relative dielectric constant increased from 2.70 to 3.21. The film deposited at a higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 450°C. All the deposited films were insulating under an applied field of ≤1 MV/cm.
Bibliography
Chun Quan, Y., Jongryang Joo, J. J., & Donggeun Jung, D. J. (1999). Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization. Japanese Journal of Applied Physics, 38(3R), 1356.
References
9
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Dates
Type | When |
---|---|
Created | 22 years, 11 months ago (Oct. 1, 2002, 6:51 p.m.) |
Deposited | 2 years, 8 months ago (Dec. 14, 2022, 12:04 p.m.) |
Indexed | 6 months, 2 weeks ago (Feb. 21, 2025, 5:33 a.m.) |
Issued | 26 years, 6 months ago (March 1, 1999) |
Published | 26 years, 6 months ago (March 1, 1999) |
Published Print | 26 years, 6 months ago (March 1, 1999) |
@article{Chun_Quan_1999, title={Polymer-like Organic Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using the Para-xylene Precursor as Low Dielectric Constant Interlayer Dielectrics for Multilevel Metallization}, volume={38}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.38.1356}, DOI={10.1143/jjap.38.1356}, number={3R}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Chun Quan, Yong and Jongryang Joo, Jongryang Joo and Donggeun Jung, Donggeun Jung}, year={1999}, month=mar, pages={1356} }