Abstract
Epitaxial titanium aluminum nitride, Ti1-x Al x N(100) (0≦x<0.5), was grown on Si(100) substrates at 600°C by low-energy reactive ion beam deposition using N2 + ion beam irradiation with 100 eV energy and Ti and Al simultaneous evaporation. The epitaxial relationship was confirmed to be Ti1-x Al x N(100)//Si(100), Ti1-x Al x N<110>//Si<110> by X-ray diffraction (XRD) and in situ reflection high-energy electron diffraction (RHEED). Although the electrical resistivity increased exponentially with x, the values remained on the order of 10-4 Ω·cm. Using the Ti1-x Al x N buffer layer, we have successfully fabricated a capacitor with an epitaxial (Ba, Sr)TiO3 film on a Si substrate.
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Dates
Type | When |
---|---|
Created | 22 years, 10 months ago (Oct. 1, 2002, 6:45 p.m.) |
Deposited | 2 years, 8 months ago (Dec. 14, 2022, 11:29 a.m.) |
Indexed | 6 months, 1 week ago (Feb. 21, 2025, 5:34 a.m.) |
Issued | 27 years, 6 months ago (Feb. 1, 1998) |
Published | 27 years, 6 months ago (Feb. 1, 1998) |
Published Print | 27 years, 6 months ago (Feb. 1, 1998) |
@article{Yanase_1998, title={Epitaxial Growth of Ti1- xAl xN Buffer Layer for a Ferroelectric (Ba, Sr)TiO3 Capacitor on Si Substrate}, volume={37}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.37.l151}, DOI={10.1143/jjap.37.l151}, number={2A}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Yanase, Naoko and Sano, Kenya and Abe, Kazuhide and Kawakubo, Takashi}, year={1998}, month=feb, pages={L151} }