Abstract
Dramatic lateral grain growth of nondoped poly-Si films (maximum grain size: ∼4.5 µm, film thickness: 500 Å) with strong crystallographic (111) orientation on glass substrates has been achieved using an excimer laser annealing method, namely at low temperature below 400°C and in a processing time shorter than a second, for the first time. The surface morphology of these poly-Si films was very smooth and the crystallinity was excellent with minimal internal defects. These poly-Si films have monomodally distributed grain sizes, with an average grain size of around 1.5 µm. As a result of experimental study, we speculate that the basic driving force behind this lateral grain growth was surface free energy anisotropy, as the same mechanism was observed in high-temperature furnace annealing of doped poly-Si thin films.
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Dates
Type | When |
---|---|
Created | 20 years, 6 months ago (Feb. 22, 2005, 9:33 p.m.) |
Deposited | 2 years, 8 months ago (Dec. 6, 2022, 5:39 p.m.) |
Indexed | 4 weeks, 1 day ago (Aug. 6, 2025, 8:40 a.m.) |
Issued | 31 years, 9 months ago (Dec. 1, 1993) |
Published | 31 years, 9 months ago (Dec. 1, 1993) |
Published Print | 31 years, 9 months ago (Dec. 1, 1993) |