Crossref journal-article
IOP Publishing
Japanese Journal of Applied Physics (266)
Abstract

A new method for obtaining real-time monitoring of stressed interconnects has been discovered. This technique uses the focused ion beam (FIB) system. Under a stress of 3 MA/cm2 at 473 K, voids grown at a triple point occurred in Al-1.0%Si interconnects, and hillocks formed, as is seen during in situ observation of the aluminum microstructure. Since this study is theoretical, additional observation and study of the electromigration phenomenon using in situ monitoring is recommended.

Bibliography

Masa-Ichi Kumikawa, M.-I. K., & Hirotaka Komoda, H. K. (1992). In Situ Focused Ion Beam (FIB) Observation of Al Electromigration. Japanese Journal of Applied Physics, 31(8B), L1147.

Authors 2
  1. Masa-Ichi Kumikawa Masa-Ichi Kumikawa (first)
  2. Hirotaka Komoda Hirotaka Komoda (additional)
References 8 Referenced 4
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  6. {'year': '1991', 'key': ''} (1991)
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  8. {'key': '', 'first-page': '35', 'volume': '34', 'year': '1991', 'journal-title': 'Solid State Technol.'} / Solid State Technol. (1991)
Dates
Type When
Created 20 years, 5 months ago (Feb. 22, 2005, 9:11 p.m.)
Deposited 2 years, 8 months ago (Dec. 6, 2022, 5:13 p.m.)
Indexed 6 months ago (Feb. 21, 2025, 5:35 a.m.)
Issued 33 years ago (Aug. 1, 1992)
Published 33 years ago (Aug. 1, 1992)
Published Print 33 years ago (Aug. 1, 1992)
Funders 0

None

@article{Masa_Ichi_Kumikawa_1992, title={In Situ Focused Ion Beam (FIB) Observation of Al Electromigration}, volume={31}, ISSN={1347-4065}, url={http://dx.doi.org/10.1143/jjap.31.l1147}, DOI={10.1143/jjap.31.l1147}, number={8B}, journal={Japanese Journal of Applied Physics}, publisher={IOP Publishing}, author={Masa-Ichi Kumikawa, Masa-Ichi Kumikawa and Hirotaka Komoda, Hirotaka Komoda}, year={1992}, month=aug, pages={L1147} }