DOI: 10.1126/science.1154367. Stretchable and Foldable Silicon Integrated Circuits

Stretchable and Foldable Silicon Integrated Circuits

10.1126/science.1154367

Crossref journal-article

American Association for the Advancement of Science (AAAS)

Science (221)

Abstract

We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and “wavy” structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three-dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical devices, that require extreme mechanical deformations during installation/use and electronic properties approaching those of conventional systems built on brittle semiconductor wafers.

Bibliography

Kim, D.-H., Ahn, J.-H., Choi, W. M., Kim, H.-S., Kim, T.-H., Song, J., Huang, Y. Y., Liu, Z., Lu, C., & Rogers, J. A. (2008). Stretchable and Foldable Silicon Integrated Circuits. Science, 320(5875), 507â511.

Authors 10

Dae-Hyeong Kim (first)
Jong-Hyun Ahn (additional)
Won Mook Choi (additional)
Hoon-Sik Kim (additional)
Tae-Ho Kim (additional)
Jizhou Song (additional)
Yonggang Y. Huang (additional)
Zhuangjian Liu (additional)
Chun Lu (additional)
John A. Rogers (additional)

References 32 Referenced 1,504

10.1109/JPROC.2005.851237
10.1073/pnas.0401918101
10.1038/nnano.2006.157
A. Dodabalapur, Mater. Today9, 24 (2006). / Mater. Today (2006)
10.1038/35000530
10.1002/adma.200602223
10.1109/TED.2002.804702
10.1021/nl0346427
10.1126/science.1116703
10.1126/science.1069153
10.1063/1.2214301
10.1126/science.1132394
10.1143/JJAP.39.393
10.1109/JPROC.2005.851502
10.1126/science.1121401
10.1002/adma.200600646
10.1039/b614793c
10.1063/1.2206688
C.-H. Lee et al., IEEE Int. Electron. Devices Meet.2006, 295 (2006). / IEEE Int. Electron. Devices Meet. (2006)
10.1063/1.1767591
10.1038/nmat1532
V. D. da Silva Mechanics and Strength of Materials (Springer New York 2005). (10.1007/3-540-30813-X)
10.1073/pnas.0702927104
10.1109/TED.2004.836648
S. Maikap et al., IEEE Int. Electron. Devices Meet.2004, 233 (2004). / IEEE Int. Electron. Devices Meet. (2004)
10.1016/S1369-8001(03)00068-4
S. G. Streetman S. K. Banerjee Solid State Electronic Devices (Pearson New Jersey 1981).
10.1109/JPROC.2005.851534
10.1063/1.2742294
Y. Sun, W. M. Choi, H. Jiang, Y. Huang, J. A. Rogers, Nat. Nanotechnol.1, 201 (2007). / Nat. Nanotechnol. (2007)
Here the tensile strains and applied strains are the global strains defined by the percentage change of substrate length.
We thank T. Banks and K. Colravy for help with processing. The materials parts of this effort were supported by the U.S. Department of Energy (DoE) Division of Materials Sciences under award DE-FG02-07ER46471 through the Materials Research Laboratory (MRL). The general characterization facilities were provided through the MRL with support from the University of Illinois and from DoE grants DE-FG02-07ER46453 and DE-FG02-07ER46471. The mechanics theory and the transfer printing systems were developed under support from the Center for Nanoscale Chemical Electrical Mechanical Manufacturing Systems at the University of Illinois (funded by the NSF under grant DMI-0328162).

Dates

Type	When
Created	17 years, 4 months ago (March 27, 2008, 9:27 p.m.)
Deposited	1 year, 7 months ago (Jan. 10, 2024, 3:36 a.m.)
Indexed	2 weeks, 5 days ago (Aug. 2, 2025, 12:52 a.m.)
Issued	17 years, 3 months ago (April 25, 2008)
Published	17 years, 3 months ago (April 25, 2008)
Published Print	17 years, 3 months ago (April 25, 2008)

Funders 0

None

BibTeX

@article{Kim_2008, title={Stretchable and Foldable Silicon Integrated Circuits}, volume={320}, ISSN={1095-9203}, url={http://dx.doi.org/10.1126/science.1154367}, DOI={10.1126/science.1154367}, number={5875}, journal={Science}, publisher={American Association for the Advancement of Science (AAAS)}, author={Kim, Dae-Hyeong and Ahn, Jong-Hyun and Choi, Won Mook and Kim, Hoon-Sik and Kim, Tae-Ho and Song, Jizhou and Huang, Yonggang Y. and Liu, Zhuangjian and Lu, Chun and Rogers, John A.}, year={2008}, month=apr, pages={507–511} }

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