Crossref journal-article
American Association for the Advancement of Science (AAAS)
Science (221)
Abstract

Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.

Bibliography

Lu, L., Shen, Y., Chen, X., Qian, L., & Lu, K. (2004). Ultrahigh Strength and High Electrical Conductivity in Copper. Science, 304(5669), 422–426.

Authors 5
  1. Lei Lu (first)
  2. Yongfeng Shen (additional)
  3. Xianhua Chen (additional)
  4. Lihua Qian (additional)
  5. K. Lu (additional)
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  21. The authors thank the National Natural Science Foundation (grants 50021101 and 50201017) the Ministry of Science and Technology of China (grant G1999064505) and the Max-Planck Society of Germany for financial support; X. Si and H. B. Ma for sample preparation; Z. H. Jin and B. Wu for discussions and TEM experiments; and X. N. Jing for electrical resistivity measurements.
Dates
Type When
Created 21 years, 5 months ago (March 22, 2004, 8:23 p.m.)
Deposited 1 year, 7 months ago (Jan. 9, 2024, 10:40 p.m.)
Indexed 2 minutes ago (Aug. 28, 2025, 4:49 a.m.)
Issued 21 years, 4 months ago (April 16, 2004)
Published 21 years, 4 months ago (April 16, 2004)
Published Print 21 years, 4 months ago (April 16, 2004)
Funders 0

None

@article{Lu_2004, title={Ultrahigh Strength and High Electrical Conductivity in Copper}, volume={304}, ISSN={1095-9203}, url={http://dx.doi.org/10.1126/science.1092905}, DOI={10.1126/science.1092905}, number={5669}, journal={Science}, publisher={American Association for the Advancement of Science (AAAS)}, author={Lu, Lei and Shen, Yongfeng and Chen, Xianhua and Qian, Lihua and Lu, K.}, year={2004}, month=apr, pages={422–426} }