DOI: 10.1117/12.442994. <title>Strength assessment of wafer-bonded micromechanical components using the micro-chevron test</title>

<title>Strength assessment of wafer-bonded micromechanical components using the micro-chevron test</title>

10.1117/12.442994

Crossref proceedings-article

SPIE

SPIE Proceedings (189)

Bibliography

Petzold, M., Knoll, H., & Bagdahn, J. (2001). <title>Strength assessment of wafer-bonded micromechanical components using the micro-chevron test</title> Reliability, Testing, and Characterization of MEMS/MOEMS, 4558, 133â142.

Authors 3

Matthias Petzold (first)
Heiko Knoll (additional)
Joerg Bagdahn (additional)

References 0 Referenced 13

None

Dates

Type	When
Created	21 years, 9 months ago (Nov. 19, 2003, 4:22 a.m.)
Deposited	12 years, 5 months ago (March 13, 2013, 3:54 p.m.)
Indexed	4 weeks, 1 day ago (July 30, 2025, 11:13 a.m.)
Issued	23 years, 10 months ago (Oct. 2, 2001)
Published	23 years, 10 months ago (Oct. 2, 2001)
Published Print	23 years, 10 months ago (Oct. 2, 2001)

Funders 0

None

BibTeX

@inproceedings{Petzold_2001, title={<title>Strength assessment of wafer-bonded micromechanical components using the micro-chevron test</title>}, volume={4558}, ISSN={0277-786X}, url={http://dx.doi.org/10.1117/12.442994}, DOI={10.1117/12.442994}, booktitle={Reliability, Testing, and Characterization of MEMS/MOEMS}, publisher={SPIE}, author={Petzold, Matthias and Knoll, Heiko and Bagdahn, Joerg}, editor={Ramesham, Rajeshuni}, year={2001}, month=oct, pages={133–142} }

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