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SPIE
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Dickson, N., Miller, J. W., Jackson, M., Kohn, S., Pyle, R. E., & Tatti, S. (1993). <title>Investigation into bake-reversible low-level ESD-induced leakage</title> Microelectronics Manufacturing and Reliability, 1802, 155–166.

Authors 6
  1. Nicholas Dickson (first)
  2. James W. Miller (additional)
  3. Mark Jackson (additional)
  4. Stella Kohn (additional)
  5. Ronald E. Pyle (additional)
  6. Sudhindra Tatti (additional)
References 0 Referenced 3

None

Dates
Type When
Created 20 years, 7 months ago (Jan. 19, 2005, 6:25 p.m.)
Deposited 12 years, 5 months ago (March 13, 2013, 6:25 p.m.)
Indexed 11 months, 2 weeks ago (Sept. 4, 2024, 8:10 a.m.)
Issued 32 years, 7 months ago (Jan. 14, 1993)
Published 32 years, 7 months ago (Jan. 14, 1993)
Published Print 32 years, 7 months ago (Jan. 14, 1993)
Funders 0

None

@inproceedings{Dickson_1993, title={&lt;title&gt;Investigation into bake-reversible low-level ESD-induced leakage&lt;/title&gt;}, volume={1802}, ISSN={0277-786X}, url={http://dx.doi.org/10.1117/12.139346}, DOI={10.1117/12.139346}, booktitle={Microelectronics Manufacturing and Reliability}, publisher={SPIE}, author={Dickson, Nicholas and Miller, James W. and Jackson, Mark and Kohn, Stella and Pyle, Ronald E. and Tatti, Sudhindra}, editor={Vasquez, Barbara and Sabnis, Anant G. and MacWilliams, Kenneth P. and Woo, Jason C.}, year={1993}, month=jan, pages={155–166} }