Abstract
Tantalum and silicon oxides have been sputter deposited onto gallium arsenide using a 500-eV beam of neutralized argon atoms. MIS devices show very low leakage and capacitances that can be varied from full accumulation to depletion with the application of modest voltages. Other measurements (breakdown field, dielectric constant, adherence, Auger profile, and photoluminescence) also suggest that these structures hold potential usefulness for insulated-gate GaAs circuitry.
Dates
Type | When |
---|---|
Created | 23 years, 1 month ago (July 27, 2002, 5:30 a.m.) |
Deposited | 2 years, 2 months ago (June 29, 2023, 12:33 a.m.) |
Indexed | 1 year, 6 months ago (Feb. 11, 2024, 7:23 a.m.) |
Issued | 48 years, 2 months ago (July 1, 1977) |
Published | 48 years, 2 months ago (July 1, 1977) |
Published Print | 48 years, 2 months ago (July 1, 1977) |
@article{Meiners_1977, title={Oxide barriers on GaAs by neutralized ion-beam sputtering}, volume={14}, ISSN={0022-5355}, url={http://dx.doi.org/10.1116/1.569400}, DOI={10.1116/1.569400}, number={4}, journal={Journal of Vacuum Science and Technology}, publisher={American Vacuum Society}, author={Meiners, L. G. and Pan, Ru-Pin and Sites, J. R.}, year={1977}, month=jul, pages={961–963} }