DOI: 10.1116/1.569140. Redeposition—A serious problem in rf sputter etching of structures with micronmeter dimensions

Redeposition—A serious problem in rf sputter etching of structures with micronmeter dimensions

10.1116/1.569140

Crossref journal-article

American Vacuum Society

Journal of Vacuum Science and Technology (20)

Bibliography

Lehmann, H. W., Krausbauer, L., & Widmer, R. (1977). RedepositionâA serious problem in rf sputter etching of structures with micronmeter dimensions. Journal of Vacuum Science and Technology, 14(1), 281â284.

Authors 3

H. W. Lehmann (first)
L. Krausbauer (additional)
R. Widmer (additional)

References 0 Referenced 57

None

Dates

Type	When
Created	23 years, 1 month ago (July 27, 2002, 5:33 a.m.)
Deposited	2 years, 4 months ago (April 20, 2023, 6:41 p.m.)
Indexed	1 year, 1 month ago (July 24, 2024, 6:34 a.m.)
Issued	48 years, 8 months ago (Jan. 1, 1977)
Published	48 years, 8 months ago (Jan. 1, 1977)
Published Print	48 years, 8 months ago (Jan. 1, 1977)

Funders 0

None

BibTeX

@article{Lehmann_1977, title={Redeposition—A serious problem in rf sputter etching of structures with micronmeter dimensions}, volume={14}, ISSN={0022-5355}, url={http://dx.doi.org/10.1116/1.569140}, DOI={10.1116/1.569140}, number={1}, journal={Journal of Vacuum Science and Technology}, publisher={American Vacuum Society}, author={Lehmann, H. W. and Krausbauer, L. and Widmer, R.}, year={1977}, month=jan, pages={281–284} }

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