DOI: 10.1116/1.3670745. Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition

Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition

10.1116/1.3670745

Crossref journal-article

American Vacuum Society

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films (20)

Abstract

Atomic layer deposition (ALD) is a technique capable of producing ultrathin conformal films with atomic level control over thickness. A major drawback of ALD is its low deposition rate, making ALD less attractive for applications that require high throughput processing. An approach to overcome this drawback is spatial ALD, i.e., an ALD mode where the half-reactions are separated spatially instead of through the use of purge steps. This allows for high deposition rate and high throughput ALD without compromising the typical ALD assets. This paper gives a perspective of past and current developments in spatial ALD. The technology is discussed and the main players are identified. Furthermore, this overview highlights current as well as new applications for spatial ALD, with a focus on photovoltaics and flexible electronics.

Bibliography

Poodt, P., Cameron, D. C., Dickey, E., George, S. M., Kuznetsov, V., Parsons, G. N., Roozeboom, F., Sundaram, G., & Vermeer, A. (2011). Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 30(1).

Authors 9

Paul Poodt (first)
David C. Cameron (additional)
Eric Dickey (additional)
Steven M. George (additional)
Vladimir Kuznetsov (additional)
Gregory N. Parsons (additional)
Fred Roozeboom (additional)
Ganesh Sundaram (additional)
Ad Vermeer (additional)

References 58 Referenced 322

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Dates

Type	When
Created	13 years, 8 months ago (Dec. 14, 2011, 6:07 p.m.)
Deposited	1 year, 4 months ago (April 15, 2024, 6:21 p.m.)
Indexed	2 weeks, 4 days ago (Aug. 6, 2025, 9:54 a.m.)
Issued	13 years, 8 months ago (Dec. 14, 2011)
Published	13 years, 8 months ago (Dec. 14, 2011)
Published Online	13 years, 8 months ago (Dec. 14, 2011)
Published Print	13 years, 7 months ago (Jan. 1, 2012)

Funders 0

None

BibTeX

@article{Poodt_2011, title={Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition}, volume={30}, ISSN={1520-8559}, url={http://dx.doi.org/10.1116/1.3670745}, DOI={10.1116/1.3670745}, number={1}, journal={Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films}, publisher={American Vacuum Society}, author={Poodt, Paul and Cameron, David C. and Dickey, Eric and George, Steven M. and Kuznetsov, Vladimir and Parsons, Gregory N. and Roozeboom, Fred and Sundaram, Ganesh and Vermeer, Ad}, year={2011}, month=dec }

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