Abstract
The metalorganic precursor cyclopentadienylethyl(dicarbonyl)ruthenium (CpRu(CO)2Et) was used to develop an atomic layer deposition (ALD) process for ruthenium. O2 gas and O2 plasma were employed as reactants. For both processes, thermal and plasma-assisted ALD, a relatively high growth-per-cycle of ∼1 Å was obtained. The Ru films were dense and polycrystalline, regardless of the reactant, yielding a resistivity of ∼16 μΩ cm. The O2 plasma not only enhanced the Ru nucleation on the TiN substrates but also led to an increased roughness compared to thermal ALD.
Bibliography
Leick, N., Verkuijlen, R. O. F., Lamagna, L., Langereis, E., Rushworth, S., Roozeboom, F., van de Sanden, M. C. M., & Kessels, W. M. M. (2011). Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 29(2).
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Dates
Type | When |
---|---|
Created | 14 years, 6 months ago (Feb. 16, 2011, 6:01 p.m.) |
Deposited | 2 years, 2 months ago (June 28, 2023, 10:54 p.m.) |
Indexed | 1 month ago (July 30, 2025, 9:10 a.m.) |
Issued | 14 years, 6 months ago (Feb. 16, 2011) |
Published | 14 years, 6 months ago (Feb. 16, 2011) |
Published Online | 14 years, 6 months ago (Feb. 16, 2011) |
Published Print | 14 years, 6 months ago (March 1, 2011) |
@article{Leick_2011, title={Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma}, volume={29}, ISSN={1520-8559}, url={http://dx.doi.org/10.1116/1.3554691}, DOI={10.1116/1.3554691}, number={2}, journal={Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films}, publisher={American Vacuum Society}, author={Leick, N. and Verkuijlen, R. O. F. and Lamagna, L. and Langereis, E. and Rushworth, S. and Roozeboom, F. and van de Sanden, M. C. M. and Kessels, W. M. M.}, year={2011}, month=feb }