DOI: 10.1116/1.1317915. Physics of Ion Plating and Ion Beam Deposition

Physics of Ion Plating and Ion Beam Deposition

10.1116/1.1317915

Crossref journal-article

American Vacuum Society

Journal of Vacuum Science and Technology (20)

Abstract

A review of some dominant mechanisms in ion plating is made. Factors influencing throwing power and film quality are discussed and the damaging effects of a high ambient gas background are considered with a view toward minimizing the harmful effects of contaminant gas background. The physical mechanisms involved in an ion beam deposition process [S. Aisenberg and R. Chabot, J. Appl. Phys. 42, 2953 (1972)] are examined. The effects of chamber pressure, electrical bias arrangements, and the introduction of a coevaporant source are discussed with regard to deposition rate, ultimate film quality, and throwing power of the system.

Bibliography

Aisenberg, S., & Chabot, R. W. (1973). Physics of Ion Plating and Ion Beam Deposition. Journal of Vacuum Science and Technology, 10(1), 104â107.

Authors 2

S. Aisenberg (first)
R. W. Chabot (additional)

References 0 Referenced 93

None

Dates

Type	When
Created	23 years ago (July 27, 2002, 5:29 a.m.)
Deposited	2 years, 1 month ago (June 23, 2023, 9:17 p.m.)
Indexed	1 month, 4 weeks ago (June 25, 2025, 8:34 p.m.)
Issued	52 years, 7 months ago (Jan. 1, 1973)
Published	52 years, 7 months ago (Jan. 1, 1973)
Published Print	52 years, 7 months ago (Jan. 1, 1973)

Funders 0

None

BibTeX

@article{Aisenberg_1973, title={Physics of Ion Plating and Ion Beam Deposition}, volume={10}, ISSN={0022-5355}, url={http://dx.doi.org/10.1116/1.1317915}, DOI={10.1116/1.1317915}, number={1}, journal={Journal of Vacuum Science and Technology}, publisher={American Vacuum Society}, author={Aisenberg, S. and Chabot, R. W.}, year={1973}, month=jan, pages={104–107} }

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