Crossref proceedings-article
American Society of Mechanical Engineers
Micro-Electro-Mechanical Systems (MEMS) (33)
Abstract

Abstract Polysilicon materials from three different suppliers were tested in tension to determine their Young’s modulus and strength. The modulus of polysilicon from Cronos was 158 ± 8 GPa and its strength 1.56 ± 0.25 GPa, and the material from Sandia National Laboratories showed 157 ± 6.5 GPa and 3.09 ± 0.18 GPa. Two polysilicons from Standard MEMS Inc. showed 164 ± 11.2 GPa and 152 ± 10.0 GPa for modulus values and 2.08 ± 0.35 GPa and 2.00 ± 0.25 GPa for strengths. Polysilicon is therefore similar to most structural materials in that its modulus is essentially constant, but its strength can depend on processing.

Bibliography

Sharpe, W. N., Jackson, K., Coles, G., & LaVan, D. A. (2000). Mechanical Properties of Different Polysilicons. Micro-Electro-Mechanical Systems (MEMS), 255–259.

Authors 4
  1. W. N. Sharpe (additional)
  2. K. Jackson (additional)
  3. G. Coles (additional)
  4. D. A. LaVan (additional)
References 0 Referenced 7

None

Dates
Type When
Created 3 years, 9 months ago (Nov. 9, 2021, 1:46 p.m.)
Deposited 3 years, 9 months ago (Nov. 9, 2021, 1:46 p.m.)
Indexed 2 months ago (June 24, 2025, 6:50 a.m.)
Issued 24 years, 9 months ago (Nov. 5, 2000)
Published 24 years, 9 months ago (Nov. 5, 2000)
Published Online 3 years, 9 months ago (Nov. 9, 2021)
Published Print 24 years, 9 months ago (Nov. 5, 2000)
Funders 0

None

@inproceedings{Sharpe_2000, series={IMECE2000}, title={Mechanical Properties of Different Polysilicons}, url={http://dx.doi.org/10.1115/imece2000-1100}, DOI={10.1115/imece2000-1100}, booktitle={Micro-Electro-Mechanical Systems (MEMS)}, publisher={American Society of Mechanical Engineers}, author={Sharpe, W. N. and Jackson, K. and Coles, G. and LaVan, D. A.}, year={2000}, month=nov, pages={255–259}, collection={IMECE2000} }