DOI: 10.1115/1.1535934. The Strength of the Silicon Die in Flip-Chip Assemblies

The Strength of the Silicon Die in Flip-Chip Assemblies

10.1115/1.1535934

Crossref journal-article

ASME International

Journal of Electronic Packaging (33)

Abstract

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the “strength” of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined.

Bibliography

Cotterell, B., Chen, Z., Han, J.-B., & Tan, N.-X. (2003). The Strength of the Silicon Die in Flip-Chip Assemblies. Journal of Electronic Packaging, 125(1), 114â119.

Authors 4

B. Cotterell (first)
Z. Chen (additional)
J.-B. Han (additional)
N.-X. Tan (additional)

References 11 Referenced 44

Ranjan, M., Gopalakrishnan, L., Srihan, K., and Woychik, 1998, “Die Cracking in Flip Chip Assemblies,” Proc., 48th Electronic Components and Technology Conference, Seattle, WA, pp. 729–733. (10.1109/ECTC.1998.678779)
Leung, B., Guo, Y., and Sarihan, V., 1997, “Die Strength in the Presence of Edge Cracks,” Application of Fracture Mechanics in Electronic Packaging, eds., W. T. Chen and D. T. Read, ASME, AMD-Vol 222, pp. 125–131. (10.1115/IMECE1997-0507)
Popelar, S. F., 1998, “An Investigation into the Fracture of Silicon Die Used in Flip Chip Applications,” Proc., Int. Symp. Advanced Packaging Materials, pp. 41–48. (10.1109/ISAPM.1998.664431)
Chen, C. P., and Leipold, M. H., 1980, “The Fracture Toughness of Silicon,” Ceram. Bull., 59, pp. 469–472.
Weibull, W., 1939, Statistical Theory of Strength of Materials, Ingeniors Vetenskaps. Akademien, Handkinger No 151.
Jayatilaka, A. De S., and Trustrum, K., 1977, “Statistical Approach to Brittle Fracture,” J. Mater. Sci., 12, pp. 1426–1430. (10.1007/BF00540858)
Trustrum, K., and Jaytilaka, A. De S., 1979, “On Estimating the Weibull Modulus for a Brittle Material,” J. Mater. Sci., 14, pp. 1080–1084. (10.1007/BF00561290)
Bergman, B. , 1986, “Estimation of Weibull Parameters Using a Weight Function,” J. Mater. Sci. Lett., 5, pp. 611–614. (10.1007/BF01731525)
Langlois, R. , 1991, “Estimation of Weibull Parameters,” J. Mater. Sci. Lett., 10, pp. 1049–1051. (10.1007/BF00720121)
Absi, J., Fournier, P., and Glandis, J. C., 1999, “Influence of Experimental Parameters on the Estimation of Weibull’s Modulus,” J. Mater. Sci., 34, pp. 1219–1227. (10.1023/A:1004561023528)
Mason, W. P., 1958, Physical Acoustics and the Properties of Solids, Van Nostrand.

Dates

Type	When
Created	22 years, 5 months ago (March 20, 2003, 6:13 p.m.)
Deposited	8 months, 1 week ago (Dec. 11, 2024, 9:01 p.m.)
Indexed	5 months ago (March 19, 2025, 12:35 p.m.)
Issued	22 years, 5 months ago (March 1, 2003)
Published	22 years, 5 months ago (March 1, 2003)
Published Online	22 years, 5 months ago (March 14, 2003)
Published Print	22 years, 5 months ago (March 1, 2003)

Funders 0

None

BibTeX

@article{Cotterell_2003, title={The Strength of the Silicon Die in Flip-Chip Assemblies}, volume={125}, ISSN={1528-9044}, url={http://dx.doi.org/10.1115/1.1535934}, DOI={10.1115/1.1535934}, number={1}, journal={Journal of Electronic Packaging}, publisher={ASME International}, author={Cotterell, B. and Chen, Z. and Han, J.-B. and Tan, N.-X.}, year={2003}, month=mar, pages={114–119} }

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