DOI: 10.1111/j.1460-2695.2006.01070.x. Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn‐based solder joints under thermal excursions

Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn‐based solder joints under thermal excursions

10.1111/j.1460-2695.2006.01070.x

Crossref journal-article

Wiley

Fatigue & Fracture of Engineering Materials & Structures (311)

Abstract

ABSTRACTSolder joints experience thermomechanical fatigue (TMF) as a consequence of thermal stresses that arise from coefficient of thermal expansion (CTE) mismatches between various entities present in the joint under thermal excursions. Sn present in solder joints made with alloys containing significant amounts of Sn, exists in a body centred tetragonal (BCT) structure, under normally realized thermal excursion regimes encountered during service. BCT Sn exhibits significant anisotropic behaviour in its physical and mechanical properties as a consequence of its highly unusual c/a ratio of about 0.5. Such severe anisotropy causes significant stresses at the Sn grain boundaries present within the solder joints during thermal excursions, resulting in damage accumulation within the solder. Stresses resulting from this anisotropy can be much larger than those that can arise from CTE mismatches between entities such as solder/substrate, solder/intermetallics etc. Damage accumulation under TMF progresses in the severely constrained region of the solder/substrate interface, and causes the initiation and propagation of the catastrophic crack. This crack propagates within the solder in a region very close to the solder/substrate interface and results in the TMF failure of the joint.

Bibliography

SUBRAMANIAN, K. N. (2006). Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Snâbased solder joints under thermal excursions. Fatigue & Fracture of Engineering Materials & Structures, 30(5), 420â431. Portico.

Authors 1

K. N. SUBRAMANIAN (first)

References 29 Referenced 12

10.1108/09540910310505080
{'key': 'e_1_2_6_3_2', 'article-title': 'Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn‐Ag based solder joints', 'author': 'Lee J. G.', 'journal-title': 'Microelectron. Reliab'} / Microelectron. Reliab / Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn‐Ag based solder joints by Lee J. G.
10.1108/09540910610647080
10.1007/s11664-003-0137-8
10.1007/s11664-003-0028-z
10.1007/s11664-001-0150-8
10.1007/s11664-997-0252-z
10.1007/s11661-005-0138-8
10.1108/09540910310455716
10.1016/S0921-5093(02)00853-5
10.1007/BF03222273
10.1007/BF03222376
10.1007/s11664-004-0103-0
10.1016/j.actamat.2004.06.010
{'key': 'e_1_2_6_16_2', 'first-page': '60', 'volume-title': 'The Mechanics of Solder Alloy Interconnects', 'author': 'Frear D. R.', 'year': '1994'} / The Mechanics of Solder Alloy Interconnects by Frear D. R. (1994)
Metals Handbook(1948)American Society for Metals Metals Park OH p.1071.
10.1007/s11664-002-0004-z
{'key': 'e_1_2_6_19_2', 'volume-title': 'Physical Properties of Crystals', 'author': 'Nye J. F.', 'year': '1979'} / Physical Properties of Crystals by Nye J. F. (1979)
10.1023/B:JMSE.0000012461.69417.75
{'key': 'e_1_2_6_21_2', 'volume-title': 'Single Crystal Elastic Constants and Calculated Aggregate properties', 'author': 'Simmons G.', 'year': '1971'} / Single Crystal Elastic Constants and Calculated Aggregate properties by Simmons G. (1971)
{'key': 'e_1_2_6_22_2', 'first-page': '1249', 'volume': '29', 'author': 'Choi S.', 'year': '2000', 'journal-title': 'Thermomech. Fatigue Behav. Sn-Ag Solder Joints'} / Thermomech. Fatigue Behav. Sn-Ag Solder Joints by Choi S. (2000)
10.1007/s11664-001-0153-5
10.1007/s11837-001-0098-4
10.1007/s11664-003-0108-0
10.1007/s11664-002-0188-2
10.1557/JMR.2005.0064
10.1557/JMR.2002.0337
10.1108/09540910510579221
10.1007/s11664-005-0197-z

Dates

Type	When
Created	18 years, 9 months ago (Nov. 21, 2006, 6:14 a.m.)
Deposited	1 year, 10 months ago (Oct. 14, 2023, 5:01 p.m.)
Indexed	1 year ago (July 30, 2024, 12:30 a.m.)
Issued	18 years, 9 months ago (Nov. 21, 2006)
Published	18 years, 9 months ago (Nov. 21, 2006)
Published Online	18 years, 9 months ago (Nov. 21, 2006)
Published Print	18 years, 3 months ago (May 1, 2007)

Funders 0

None

BibTeX

@article{SUBRAMANIAN_2006, title={Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn‐based solder joints under thermal excursions}, volume={30}, ISSN={1460-2695}, url={http://dx.doi.org/10.1111/j.1460-2695.2006.01070.x}, DOI={10.1111/j.1460-2695.2006.01070.x}, number={5}, journal={Fatigue & Fracture of Engineering Materials & Structures}, publisher={Wiley}, author={SUBRAMANIAN, K. N.}, year={2006}, month=nov, pages={420–431} }

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