DOI: 10.1109/tchmt.1981.1135845. Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints

Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints

10.1109/tchmt.1981.1135845

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components, Hybrids, and Manufacturing Technology (263)

Bibliography

Levine, E., & Ordonez, J. (1981). Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 4(4), 515â519.

Authors 2

E. Levine (first)
J. Ordonez (additional)

References 0 Referenced 20

None

Dates

Type	When
Created	21 years, 3 months ago (April 28, 2004, 8:28 p.m.)
Deposited	3 years, 7 months ago (Jan. 12, 2022, 11:02 a.m.)
Indexed	1 year, 11 months ago (Sept. 13, 2023, 1:42 p.m.)
Issued	43 years, 8 months ago (Dec. 1, 1981)
Published	43 years, 8 months ago (Dec. 1, 1981)
Published Print	43 years, 8 months ago (Dec. 1, 1981)

Funders 0

None

BibTeX

@article{Levine_1981, title={Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints}, volume={4}, ISSN={0148-6411}, url={http://dx.doi.org/10.1109/tchmt.1981.1135845}, DOI={10.1109/tchmt.1981.1135845}, number={4}, journal={IEEE Transactions on Components, Hybrids, and Manufacturing Technology}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Levine, E. and Ordonez, J.}, year={1981}, month=dec, pages={515–519} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2023,
        9,
        13
      ]
    ],
    "date-time": "2023-09-13T17:42:46Z",
    "timestamp": 1694626966156
  },
  "reference-count": 0,
  "publisher": "Institute of Electrical and Electronics Engineers (IEEE)",
  "issue": "4",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            1981,
            12,
            1
          ]
        ],
        "date-time": "1981-12-01T00:00:00Z",
        "timestamp": 376012800000
      },
      "content-version": "vor",
      "delay-in-days": 0,
      "URL": "https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        1981,
        12
      ]
    ]
  },
  "DOI": "10.1109/tchmt.1981.1135845",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2004,
        4,
        29
      ]
    ],
    "date-time": "2004-04-29T00:28:59Z",
    "timestamp": 1083198539000
  },
  "page": "515-519",
  "source": "Crossref",
  "is-referenced-by-count": 20,
  "title": "Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints",
  "prefix": "10.1109",
  "volume": "4",
  "author": [
    {
      "given": "E.",
      "family": "Levine",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "J.",
      "family": "Ordonez",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "263",
  "container-title": "IEEE Transactions on Components, Hybrids, and Manufacturing Technology",
  "original-title": [],
  "language": "en",
  "link": [
    {
      "URL": "http://xplorestaging.ieee.org/ielx6/33/25276/01135845.pdf?arnumber=1135845",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2022,
        1,
        12
      ]
    ],
    "date-time": "2022-01-12T16:02:22Z",
    "timestamp": 1642003342000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://ieeexplore.ieee.org/document/1135845/"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1981,
        12
      ]
    ]
  },
  "references-count": 0,
  "journal-issue": {
    "issue": "4",
    "published-print": {
      "date-parts": [
        [
          1981,
          12
        ]
      ]
    }
  },
  "URL": "http://dx.doi.org/10.1109/TCHMT.1981.1135845",
  "relation": {},
  "ISSN": [
    "0148-6411"
  ],
  "subject": [],
  "container-title-short": "IEEE Trans. Comp., Hybrids, Manufact. Technol.",
  "published": {
    "date-parts": [
      [
        1981,
        12
      ]
    ]
  }
}