DOI: 10.1109/tcapt.2006.875876. Enhanced thermal contact conductance using carbon nanotube array interfaces

Enhanced thermal contact conductance using carbon nanotube array interfaces

10.1109/tcapt.2006.875876

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components and Packaging Technologies (263)

Bibliography

Jun Xu, & Fisher, T. S. (2006). Enhanced thermal contact conductance using carbon nanotube array interfaces. IEEE Transactions on Components and Packaging Technologies, 29(2), 261â267.

Authors 2

Jun Xu (first)
T.S. Fisher (additional)

References 41 Referenced 78

{'volume-title': 'International Technology Roadmap for Semiconductors, 2004 Update', 'key': 'ref1'} / International Technology Roadmap for Semiconductors, 2004 Update
10.1535/itj.0901.06
{'key': 'ref3', 'first-page': '14', 'article-title': 'Thermal interface materials', 'volume': '9', 'author': 'Blazei', 'year': '2003', 'journal-title': 'Electron. Cooling'} / Electron. Cooling / Thermal interface materials by Blazei (2003)
10.1038/354056a0
10.1103/PhysRevLett.84.4613
10.1088/0957-4484/11/2/305
10.1103/PhysRevLett.87.215502
10.1080/10893950390150467
10.1016/S0370-1573(02)00558-6
10.1115/HT2003-47263
10.1063/1.1408272
10.1063/1.1469696
10.1038/nmat996
10.1557/PROC-812-F3.18
10.1109/ITHERM.2004.1319188
10.1063/1.1319529
10.1063/1.1314614
10.1016/j.cplett.2003.08.103
{'volume-title': 'Science of Fullerenes and Carbon Nanotubes', 'year': '1996', 'author': 'Dresselhaus', 'key': 'ref19'} / Science of Fullerenes and Carbon Nanotubes by Dresselhaus (1996)
10.1126/science.273.5274.483
10.1126/science.288.5465.492
10.1063/1.1601303
10.1063/1.1566803
10.1016/j.cplett.2003.10.007
10.1063/1.1400085
10.1063/1.1364507
10.1063/1.1320024
10.1063/1.123291
10.1063/1.124128
10.1016/0029-5493(85)90302-4
{'volume-title': 'C10100 Copper Alloys [CDA 101/Copper Alloy 101/OFHC, C101] Material Property Data Sheet', 'year': '2006', 'key': 'ref31'} / C10100 Copper Alloys [CDA 101/Copper Alloy 101/OFHC, C101] Material Property Data Sheet (2006)
{'volume-title': 'Silicon wafer processing', 'year': '2000', 'author': 'Bates', 'key': 'ref32'} / Silicon wafer processing by Bates (2000)
10.1115/1.483144
{'key': 'ref34', 'first-page': '325', 'volume-title': 'Engineering Statistics', 'author': 'Bowker', 'year': '1972'} / Engineering Statistics by Bowker (1972)
{'key': 'ref35', 'first-page': '49', 'volume-title': 'Experimental Methods for Engineers', 'author': 'Holman', 'year': '1994'} / Experimental Methods for Engineers by Holman (1994)
10.2514/2.6433
10.2514/6.2001-217
{'volume-title': 'Honeywell Electronic Materials', 'year': '2003', 'key': 'ref38'} / Honeywell Electronic Materials (2003)
10.1021/nl048506t
10.1115/1.2352778
10.1016/j.ijheatmasstransfer.2005.09.039

Dates

Type	When
Created	19 years, 2 months ago (June 1, 2006, 9:22 p.m.)
Deposited	4 months, 4 weeks ago (March 24, 2025, 5:57 a.m.)
Indexed	4 months, 4 weeks ago (March 24, 2025, 6:10 a.m.)
Issued	19 years, 2 months ago (June 1, 2006)
Published	19 years, 2 months ago (June 1, 2006)
Published Print	19 years, 2 months ago (June 1, 2006)

Funders 0

None

BibTeX

@article{Jun_Xu_2006, title={Enhanced thermal contact conductance using carbon nanotube array interfaces}, volume={29}, ISSN={1521-3331}, url={http://dx.doi.org/10.1109/tcapt.2006.875876}, DOI={10.1109/tcapt.2006.875876}, number={2}, journal={IEEE Transactions on Components and Packaging Technologies}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Jun Xu and Fisher, T.S.}, year={2006}, month=jun, pages={261–267} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        3,
        24
      ]
    ],
    "date-time": "2025-03-24T10:10:03Z",
    "timestamp": 1742811003246,
    "version": "3.40.2"
  },
  "reference-count": 41,
  "publisher": "Institute of Electrical and Electronics Engineers (IEEE)",
  "issue": "2",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            2006,
            6,
            1
          ]
        ],
        "date-time": "2006-06-01T00:00:00Z",
        "timestamp": 1149120000000
      },
      "content-version": "vor",
      "delay-in-days": 0,
      "URL": "https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2006,
        6
      ]
    ]
  },
  "DOI": "10.1109/tcapt.2006.875876",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2006,
        6,
        2
      ]
    ],
    "date-time": "2006-06-02T01:22:18Z",
    "timestamp": 1149211338000
  },
  "page": "261-267",
  "source": "Crossref",
  "is-referenced-by-count": 78,
  "title": "Enhanced thermal contact conductance using carbon nanotube array interfaces",
  "prefix": "10.1109",
  "volume": "29",
  "author": [
    {
      "family": "Jun Xu",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "T.S.",
      "family": "Fisher",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "263",
  "reference": [
    {
      "volume-title": "International Technology Roadmap for Semiconductors, 2004 Update",
      "key": "ref1"
    },
    {
      "key": "ref2",
      "doi-asserted-by": "publisher",
      "DOI": "10.1535/itj.0901.06"
    },
    {
      "key": "ref3",
      "first-page": "14",
      "article-title": "Thermal interface materials",
      "volume": "9",
      "author": "Blazei",
      "year": "2003",
      "journal-title": "Electron. Cooling"
    },
    {
      "key": "ref4",
      "doi-asserted-by": "publisher",
      "DOI": "10.1038/354056a0"
    },
    {
      "key": "ref5",
      "doi-asserted-by": "publisher",
      "DOI": "10.1103/PhysRevLett.84.4613"
    },
    {
      "key": "ref6",
      "doi-asserted-by": "publisher",
      "DOI": "10.1088/0957-4484/11/2/305"
    },
    {
      "key": "ref7",
      "doi-asserted-by": "publisher",
      "DOI": "10.1103/PhysRevLett.87.215502"
    },
    {
      "key": "ref8",
      "doi-asserted-by": "publisher",
      "DOI": "10.1080/10893950390150467"
    },
    {
      "key": "ref9",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/S0370-1573(02)00558-6"
    },
    {
      "key": "ref10",
      "doi-asserted-by": "publisher",
      "DOI": "10.1115/HT2003-47263"
    },
    {
      "key": "ref11",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1408272"
    },
    {
      "key": "ref12",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1469696"
    },
    {
      "key": "ref13",
      "doi-asserted-by": "publisher",
      "DOI": "10.1038/nmat996"
    },
    {
      "key": "ref14",
      "doi-asserted-by": "publisher",
      "DOI": "10.1557/PROC-812-F3.18"
    },
    {
      "key": "ref15",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/ITHERM.2004.1319188"
    },
    {
      "key": "ref16",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1319529"
    },
    {
      "key": "ref17",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1314614"
    },
    {
      "key": "ref18",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/j.cplett.2003.08.103"
    },
    {
      "volume-title": "Science of Fullerenes and Carbon Nanotubes",
      "year": "1996",
      "author": "Dresselhaus",
      "key": "ref19"
    },
    {
      "key": "ref20",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.273.5274.483"
    },
    {
      "key": "ref21",
      "doi-asserted-by": "publisher",
      "DOI": "10.1126/science.288.5465.492"
    },
    {
      "key": "ref22",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1601303"
    },
    {
      "key": "ref23",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1566803"
    },
    {
      "key": "ref24",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/j.cplett.2003.10.007"
    },
    {
      "key": "ref25",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1400085"
    },
    {
      "key": "ref26",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1364507"
    },
    {
      "key": "ref27",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.1320024"
    },
    {
      "key": "ref28",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.123291"
    },
    {
      "key": "ref29",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.124128"
    },
    {
      "key": "ref30",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/0029-5493(85)90302-4"
    },
    {
      "volume-title": "C10100 Copper Alloys [CDA 101/Copper Alloy 101/OFHC, C101] Material Property Data Sheet",
      "year": "2006",
      "key": "ref31"
    },
    {
      "volume-title": "Silicon wafer processing",
      "year": "2000",
      "author": "Bates",
      "key": "ref32"
    },
    {
      "key": "ref33",
      "doi-asserted-by": "publisher",
      "DOI": "10.1115/1.483144"
    },
    {
      "key": "ref34",
      "first-page": "325",
      "volume-title": "Engineering Statistics",
      "author": "Bowker",
      "year": "1972"
    },
    {
      "key": "ref35",
      "first-page": "49",
      "volume-title": "Experimental Methods for Engineers",
      "author": "Holman",
      "year": "1994"
    },
    {
      "key": "ref36",
      "doi-asserted-by": "publisher",
      "DOI": "10.2514/2.6433"
    },
    {
      "key": "ref37",
      "doi-asserted-by": "publisher",
      "DOI": "10.2514/6.2001-217"
    },
    {
      "volume-title": "Honeywell Electronic Materials",
      "year": "2003",
      "key": "ref38"
    },
    {
      "key": "ref39",
      "doi-asserted-by": "publisher",
      "DOI": "10.1021/nl048506t"
    },
    {
      "key": "ref40",
      "doi-asserted-by": "publisher",
      "DOI": "10.1115/1.2352778"
    },
    {
      "key": "ref41",
      "doi-asserted-by": "publisher",
      "DOI": "10.1016/j.ijheatmasstransfer.2005.09.039"
    }
  ],
  "container-title": "IEEE Transactions on Components and Packaging Technologies",
  "original-title": [],
  "link": [
    {
      "URL": "http://xplorestaging.ieee.org/ielx5/6144/34330/01637757.pdf?arnumber=1637757",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2025,
        3,
        24
      ]
    ],
    "date-time": "2025-03-24T09:57:23Z",
    "timestamp": 1742810243000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://ieeexplore.ieee.org/document/1637757/"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2006,
        6
      ]
    ]
  },
  "references-count": 41,
  "journal-issue": {
    "issue": "2"
  },
  "URL": "http://dx.doi.org/10.1109/TCAPT.2006.875876",
  "relation": {},
  "ISSN": [
    "1521-3331"
  ],
  "subject": [],
  "container-title-short": "IEEE Trans. Comp. Packag. Technol.",
  "published": {
    "date-parts": [
      [
        2006,
        6
      ]
    ]
  }
}