Crossref
journal-article
Institute of Electrical and Electronics Engineers (IEEE)
IEEE Transactions on Components and Packaging Technologies (263)
References
114
Referenced
286
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Dates
Type | When |
---|---|
Created | 20 years, 2 months ago (May 24, 2005, 10:38 a.m.) |
Deposited | 4 months, 1 week ago (April 11, 2025, 12:28 a.m.) |
Indexed | 13 hours, 22 minutes ago (Aug. 21, 2025, 2:02 p.m.) |
Issued | 20 years, 2 months ago (June 1, 2005) |
Published | 20 years, 2 months ago (June 1, 2005) |
Published Print | 20 years, 2 months ago (June 1, 2005) |
@article{Yovanovich_2005, title={Four decades of research on thermal contact, gap, and joint resistance in microelectronics}, volume={28}, ISSN={1521-3331}, url={http://dx.doi.org/10.1109/tcapt.2005.848483}, DOI={10.1109/tcapt.2005.848483}, number={2}, journal={IEEE Transactions on Components and Packaging Technologies}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Yovanovich, M.M.}, year={2005}, month=jun, pages={182–206} }