Crossref
journal-article
Institute of Electrical and Electronics Engineers (IEEE)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (263)
References
17
Referenced
24
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{'volume-title': 'Circuit, Interconnections and Packaging for VLSI', 'year': '1989', 'author': 'Bakoglu', 'key': 'ref2'}
/ Circuit, Interconnections and Packaging for VLSI by Bakoglu (1989)10.1109/PROC.1981.12170
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10.1109/43.974140
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10.1145/513918.513936
10.1145/505388.505405
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10.1145/378239.379021
Dates
Type | When |
---|---|
Created | 22 years, 5 months ago (March 7, 2003, 1:58 p.m.) |
Deposited | 5 months, 1 week ago (March 19, 2025, 2:07 a.m.) |
Indexed | 5 months, 1 week ago (March 22, 2025, 4:39 a.m.) |
Issued | 22 years, 5 months ago (March 1, 2003) |
Published | 22 years, 5 months ago (March 1, 2003) |
Published Print | 22 years, 5 months ago (March 1, 2003) |
@article{Tan_2003, title={Efficient very large scale integration power/ground network sizing based on equivalent circuit modeling}, volume={22}, ISSN={0278-0070}, url={http://dx.doi.org/10.1109/tcad.2002.807883}, DOI={10.1109/tcad.2002.807883}, number={3}, journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Tan, S.X.-D. and Shi, C.-J.R.}, year={2003}, month=mar, pages={277–284} }