DOI: 10.1109/t-ed.1984.21734. Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors

Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors

10.1109/t-ed.1984.21734

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Electron Devices (263)

Bibliography

Iyer, S. S., & Chung-Yu Ting. (1984). Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors. IEEE Transactions on Electron Devices, 31(10), 1468â1471.

Authors 2

S.S. Iyer (first)
Chung-Yu Ting (additional)

References 0 Referenced 19

None

Dates

Type	When
Created	17 years, 7 months ago (Jan. 11, 2008, 2:03 p.m.)
Deposited	1 month ago (July 21, 2025, 2:06 p.m.)
Indexed	3 weeks ago (Aug. 2, 2025, 12:30 p.m.)
Issued	40 years, 10 months ago (Oct. 1, 1984)
Published	40 years, 10 months ago (Oct. 1, 1984)
Published Print	40 years, 10 months ago (Oct. 1, 1984)

Funders 0

None

BibTeX

@article{Iyer_1984, title={Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors}, volume={31}, ISSN={1557-9646}, url={http://dx.doi.org/10.1109/t-ed.1984.21734}, DOI={10.1109/t-ed.1984.21734}, number={10}, journal={IEEE Transactions on Electron Devices}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Iyer, S.S. and Chung-Yu Ting}, year={1984}, month=oct, pages={1468–1471} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        8,
        2
      ]
    ],
    "date-time": "2025-08-02T16:30:02Z",
    "timestamp": 1754152202347,
    "version": "3.41.2"
  },
  "reference-count": 0,
  "publisher": "Institute of Electrical and Electronics Engineers (IEEE)",
  "issue": "10",
  "license": [
    {
      "start": {
        "date-parts": [
          [
            1984,
            10,
            1
          ]
        ],
        "date-time": "1984-10-01T00:00:00Z",
        "timestamp": 465436800000
      },
      "content-version": "vor",
      "delay-in-days": 0,
      "URL": "https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html"
    },
    {
      "start": {
        "date-parts": [
          [
            1984,
            10,
            1
          ]
        ],
        "date-time": "1984-10-01T00:00:00Z",
        "timestamp": 465436800000
      },
      "content-version": "stm-asf",
      "delay-in-days": 0,
      "URL": "https://doi.org/10.15223/policy-029"
    },
    {
      "start": {
        "date-parts": [
          [
            1984,
            10,
            1
          ]
        ],
        "date-time": "1984-10-01T00:00:00Z",
        "timestamp": 465436800000
      },
      "content-version": "stm-asf",
      "delay-in-days": 0,
      "URL": "https://doi.org/10.15223/policy-037"
    }
  ],
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        1984,
        10
      ]
    ]
  },
  "DOI": "10.1109/t-ed.1984.21734",
  "type": "journal-article",
  "created": {
    "date-parts": [
      [
        2008,
        1,
        11
      ]
    ],
    "date-time": "2008-01-11T19:03:48Z",
    "timestamp": 1200078228000
  },
  "page": "1468-1471",
  "source": "Crossref",
  "is-referenced-by-count": 19,
  "title": "Electromigration lifetime sudies of submicrometer-linewidth Al-Cu conductors",
  "prefix": "10.1109",
  "volume": "31",
  "author": [
    {
      "given": "S.S.",
      "family": "Iyer",
      "sequence": "first",
      "affiliation": [
        {
          "name": "IBM Thomas J. Watson Research Center, Yorktown Heights, NY"
        }
      ]
    },
    {
      "family": "Chung-Yu Ting",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "263",
  "container-title": "IEEE Transactions on Electron Devices",
  "original-title": [],
  "link": [
    {
      "URL": "http://xplorestaging.ieee.org/ielx5/16/31907/01484019.pdf?arnumber=1484019",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2025,
        7,
        21
      ]
    ],
    "date-time": "2025-07-21T18:06:49Z",
    "timestamp": 1753121209000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "https://ieeexplore.ieee.org/document/1484019/"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        1984,
        10
      ]
    ]
  },
  "references-count": 0,
  "journal-issue": {
    "issue": "10"
  },
  "URL": "http://dx.doi.org/10.1109/T-ED.1984.21734",
  "relation": {},
  "ISSN": [
    "0018-9383",
    "1557-9646"
  ],
  "subject": [],
  "container-title-short": "IEEE Trans. Electron Devices",
  "published": {
    "date-parts": [
      [
        1984,
        10
      ]
    ]
  }
}