DOI: 10.1109/jproc.2006.879796. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

Thermal Interface Materials: Historical Perspective, Status, and Future Directions

10.1109/jproc.2006.879796

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

Proceedings of the IEEE (263)

Bibliography

Prasher, R. (2006). Thermal Interface Materials: Historical Perspective, Status, and Future Directions. Proceedings of the IEEE, 94(8), 1571â1586.

Authors 1

R. Prasher (first)

References 85 Referenced 779

10.1103/PhysRevLett.87.215502
10.1109/STHERM.2004.1291308
10.1109/TCAPT.2004.828584
10.1016/S0026-2714(01)00129-9
10.1016/S0266-3538(01)00094-X
10.1063/1.1756680
10.1007/s003390201277
10.1115/1.1915387
10.1063/1.1469696
10.1115/1.2825917
10.1038/nmat996
10.1063/1.1808874
10.1063/1.359302
10.1177/002199838702100602
10.1109/TCAPT.2004.828587
10.1115/IMECE2004-62027
10.1016/0956-7151(92)90205-S
10.1111/j.1151-2916.1975.tb19020.x
10.1016/j.ijheatmasstransfer.2004.01.013
10.1063/1.365209
{'key': 'ref60', 'author': 'zhang', 'year': '2004', 'journal-title': 'Constructive Modeling Strategies and Implementation Frameworks for Hierarchical Synthesis'} / Constructive Modeling Strategies and Implementation Frameworks for Hierarchical Synthesis by zhang (2004)
10.1109/95.335037
{'key': 'ref61', 'article-title': 'a unified macroscopic and microscopic approach to contact conduction heat transfer', 'author': 'prasher', 'year': '2001', 'journal-title': 'Proc 35th Nat Heat Transfer Conf'} / Proc 35th Nat Heat Transfer Conf / a unified macroscopic and microscopic approach to contact conduction heat transfer by prasher (2001)
{'key': 'ref63', 'first-page': '711', 'article-title': 'thermal conductivity of a chain of particles in close contact in a matrix of epoxy resin', 'volume': '22', 'author': 'bujard', 'year': '1994', 'journal-title': 'Thermal Conductivity'} / Thermal Conductivity / thermal conductivity of a chain of particles in close contact in a matrix of epoxy resin by bujard (1994)
10.1109/ITHERM.2002.1012518
10.1007/978-94-015-9213-0 / Rheology of Filled Polymer System by shenoy (1999)
10.1109/TCAPT.2004.838883
10.1103/PhysRevB.38.7173
10.1002/app.1970.070140604
{'key': 'ref29', 'article-title': 'thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions', 'author': 'hu', 'year': '2004', 'journal-title': '9th Intersoc Conf Thermal and Thermomechanical Phenomena in Electronic Systems'} / 9th Intersoc Conf Thermal and Thermomechanical Phenomena in Electronic Systems / thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions by hu (2004)
10.1007/s002310050238
10.1535/itj.0901.06 / Intel Technol J / some thermal technology and thermal management considerations in the design of next generation intel centrino mobile technology platforms by samson (2005)
10.1063/1.347544
10.1007/978-1-4612-3978-9 / Thermal Contact Conductance by madhusudana (1996)
{'key': 'ref1', 'first-page': '261', 'author': 'yovanovich', 'year': '2003', 'journal-title': 'Heat Transfer Handbook'} / Heat Transfer Handbook by yovanovich (2003)
10.1115/1.483144
10.2514/2.6598
{'key': 'ref21', 'first-page': '51', 'article-title': 'modeling and measurement of pressure-dependent junction-spreader thermal resistance for integrated circuits', 'author': 'zhou', 'year': '2001', 'journal-title': 'Proc ASME Int Mechanical Engineering Congr and Exposition'} / Proc ASME Int Mechanical Engineering Congr and Exposition / modeling and measurement of pressure-dependent junction-spreader thermal resistance for integrated circuits by zhou (2001)
10.1115/1.1602703
{'key': 'ref23', 'article-title': 'rheological study of micro particle laden polymeric thermal interface materials: experimental (part 1) and modeling (part 2)', 'author': 'prasher', 'year': '2002', 'journal-title': 'International Mechanical Engineering Congress and Exposition'} / International Mechanical Engineering Congress and Exposition / rheological study of micro particle laden polymeric thermal interface materials: experimental (part 1) and modeling (part 2) by prasher (2002)
10.1109/ITHERM.2004.1319151
10.1115/1.1621893
{'key': 'ref50', 'first-page': '341', 'article-title': 'electrophysical properties of a percolation layer of finite thickness', 'volume': '71', 'author': 'neimark', 'year': '1990', 'journal-title': 'Soviet Phys JETP'} / Soviet Phys JETP / electrophysical properties of a percolation layer of finite thickness by neimark (1990)
10.1080/108939501753222869
{'key': 'ref59', 'volume': '2', 'author': 'kreider', 'year': '1999', 'journal-title': 'Guide to Engineering Plastics'} / Guide to Engineering Plastics by kreider (1999)
{'key': 'ref58', 'first-page': '505', 'article-title': 'rapid thermal conductivity measurement with a hot disk sensor: part 2. charecterization of thermal greases', 'author': 'he', 'year': '2002', 'journal-title': 'Proc 30th North Amer Thermal Analysis Soc Conf'} / Proc 30th North Amer Thermal Analysis Soc Conf / rapid thermal conductivity measurement with a hot disk sensor: part 2. charecterization of thermal greases by he (2002)
{'key': 'ref57', 'first-page': '499', 'article-title': 'rapid thermal conductivity measurement with a hot disk sensor: part 1. theoretical considerations', 'author': 'he', 'year': '2002', 'journal-title': 'Proc 30th North Amer Thermal Analysis Soc Conf'} / Proc 30th North Amer Thermal Analysis Soc Conf / rapid thermal conductivity measurement with a hot disk sensor: part 1. theoretical considerations by he (2002)
10.1002/pen.760160905
10.1063/1.335924
10.1103/PhysRevLett.84.2961
10.1143/JPSJ.64.164
10.1103/PhysRevB.69.184201
10.1109/TADVP.2005.858439
{'key': 'ref11', 'article-title': 'thermal interface materials: a brief review of design characteristics and materials', 'volume': '10', 'author': 'mahajan', 'year': '2004', 'journal-title': 'Electron Cooling'} / Electron Cooling / thermal interface materials: a brief review of design characteristics and materials by mahajan (2004)
10.1109/ITHERM.2000.866803
10.1016/S0026-2692(02)00191-X
{'key': 'ref13', 'article-title': 'thermal conductance of filled aluminum and magnesium joints in a vacuum environment', 'author': 'cunnington', 'year': '1964', 'journal-title': 'ASME Winter Annu Meeting'} / ASME Winter Annu Meeting / thermal conductance of filled aluminum and magnesium joints in a vacuum environment by cunnington (1964)
10.2514/6.1967-316 / Thermophysics Specialist Conf / spacecraft thermal joint conduction by getty (1967)
10.2514/3.792
10.1109/33.62543
{'key': 'ref82', 'article-title': 'thermal characterization of aligned carbon nanotubes on silicon', 'author': 'hu', 'year': '2005', 'journal-title': 'IEEE SEMI-THERM 21'} / IEEE SEMI-THERM 21 / thermal characterization of aligned carbon nanotubes on silicon by hu (2005)
10.2514/2.6232
10.1115/IMECE2004-60185
10.2514/2.6361
{'key': 'ref84', 'first-page': '193', 'article-title': 'effects of nano-sized particles on electrical and thermal conductivities of polymer composites', 'author': 'fan', 'year': '2004', 'journal-title': 'Proc 9th Int Symp Advanced Packaging Materials'} / Proc 9th Int Symp Advanced Packaging Materials / effects of nano-sized particles on electrical and thermal conductivities of polymer composites by fan (2004)
10.1557/PROC-515-215
10.1109/CEIDP.2003.1254809
{'key': 'ref80', 'first-page': '549', 'article-title': 'enhanced thermal contact conductance using carbon nanotube arrays', 'author': 'xu', 'year': '0', 'journal-title': 'PROC 2004 Intersoc Conf Thermal Phenomena'} / PROC 2004 Intersoc Conf Thermal Phenomena / enhanced thermal contact conductance using carbon nanotube arrays by xu (0)
10.1115/1.1464565
10.1016/0011-2275(96)83806-9
10.1115/1.1388301
10.1109/ECTC.1998.678827
10.1063/1.1619202
{'key': 'ref8', 'article-title': 'cooling a chip: a packaging perspective', 'volume': '94', 'author': 'mahajan', 'year': '2006', 'journal-title': 'Proc IEEE'} / Proc IEEE / cooling a chip: a packaging perspective by mahajan (2006)
10.1063/1.367020
10.1109/JPROC.2003.818324
{'key': 'ref9', 'article-title': 'spreadsheet tool for quick-turn 3-d numerical modeling of package thermal performance with non-uniform die heating', 'author': 'watwe', 'year': '0', 'journal-title': '2001 ASME Int Mechanical Engineering Congress and Exposition'} / 2001 ASME Int Mechanical Engineering Congress and Exposition / spreadsheet tool for quick-turn 3-d numerical modeling of package thermal performance with non-uniform die heating by watwe (0)
10.1002/3527602798
10.1016/S0017-9310(99)00387-7
10.1103/PhysRevB.56.1236
{'key': 'ref47', 'first-page': '361', 'article-title': 'finite scaling of the effective conductivity in percolation systems with nonzero ratio of the phase conductivities', 'volume': '82', 'author': 'morozovskii', 'year': '1996', 'journal-title': 'JETP'} / JETP / finite scaling of the effective conductivity in percolation systems with nonzero ratio of the phase conductivities by morozovskii (1996)
10.1063/1.31150
10.1103/RevModPhys.45.574
10.1615/IHTC11.690 / Proc 11th Int Heat Transfer Conf / anisotropic thermal conductance in thin layers of disordered packed spheres by liang (1998)
10.1063/1.346379

Dates

Type	When
Created	18 years, 10 months ago (Sept. 29, 2006, 3:04 p.m.)
Deposited	3 years, 8 months ago (Nov. 29, 2021, 3:22 p.m.)
Indexed	1 day, 6 hours ago (Aug. 26, 2025, 2:24 a.m.)
Issued	19 years ago (Aug. 1, 2006)
Published	19 years ago (Aug. 1, 2006)
Published Print	19 years ago (Aug. 1, 2006)

Funders 0

None

BibTeX

@article{Prasher_2006, title={Thermal Interface Materials: Historical Perspective, Status, and Future Directions}, volume={94}, ISSN={1558-2256}, url={http://dx.doi.org/10.1109/jproc.2006.879796}, DOI={10.1109/jproc.2006.879796}, number={8}, journal={Proceedings of the IEEE}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Prasher, R.}, year={2006}, month=aug, pages={1571–1586} }

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      "journal-title": "Proc 35th Nat Heat Transfer Conf"
    },
    {
      "key": "ref63",
      "first-page": "711",
      "article-title": "thermal conductivity of a chain of particles in close contact in a matrix of epoxy resin",
      "volume": "22",
      "author": "bujard",
      "year": "1994",
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    },
    {
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      "doi-asserted-by": "publisher",
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    {
      "key": "ref64",
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      "DOI": "10.1007/978-94-015-9213-0",
      "author": "shenoy",
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    },
    {
      "key": "ref27",
      "doi-asserted-by": "publisher",
      "DOI": "10.1109/TCAPT.2004.838883"
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    {
      "key": "ref65",
      "doi-asserted-by": "publisher",
      "DOI": "10.1103/PhysRevB.38.7173"
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    {
      "key": "ref66",
      "doi-asserted-by": "publisher",
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      "article-title": "thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions",
      "author": "hu",
      "year": "2004",
      "journal-title": "9th Intersoc Conf Thermal and Thermomechanical Phenomena in Electronic Systems"
    },
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      "key": "ref67",
      "doi-asserted-by": "publisher",
      "DOI": "10.1007/s002310050238"
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      "author": "samson",
      "year": "2005",
      "journal-title": "Intel Technol J"
    },
    {
      "key": "ref69",
      "doi-asserted-by": "publisher",
      "DOI": "10.1063/1.347544"
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      "year": "1996",
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    },
    {
      "key": "ref1",
      "first-page": "261",
      "author": "yovanovich",
      "year": "2003",
      "journal-title": "Heat Transfer Handbook"
    },
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      "journal-title": "Proc 11th Int Heat Transfer Conf"
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