DOI: 10.1109/iedm.2008.4796762. A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

10.1109/iedm.2008.4796762

Crossref proceedings-article

IEEE

2008 IEEE International Electron Devices Meeting (263)

Bibliography

Liu, F., Yu, R. R., Young, A. M., Doyle, J. P., Wang, X., Shi, L., Chen, K.-N., Li, X., Dipaola, D. A., Brown, D., Ryan, C. T., Hagan, J. A., Wong, K. H., Lu, M., Gu, X., Klymko, N. R., Perfecto, E. D., Merryman, A. G., Kelly, K. A., â¦ Haensch, W. (2008). A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding. 2008 IEEE International Electron Devices Meeting, 1â4.

Authors 23

F. Liu (first)
R. R. Yu (additional)
A. M. Young (additional)
J. P. Doyle (additional)
X. Wang (additional)
L. Shi (additional)
K.-N. Chen (additional)
X. Li (additional)
D. A. Dipaola (additional)
D. Brown (additional)
C. T. Ryan (additional)
J. A. Hagan (additional)
K. H. Wong (additional)
M. Lu (additional)
X. Gu (additional)
N. R. Klymko (additional)
E. D. Perfecto (additional)
A. G. Merryman (additional)
K. A. Kelly (additional)
S. Purushothaman (additional)
S. J. Koester (additional)
R. Wisnieff (additional)
W. Haensch (additional)

References 5 Referenced 76

{'journal-title': 'International Interconnect Technology Conference(IITC)', 'year': '2008', 'author': 'tu', 'key': '3'} / International Interconnect Technology Conference(IITC) by tu (2008)
{'journal-title': 'International Electron Devices Meeting (IEDM)', 'year': '2006', 'author': 'swinnen', 'key': '2'} / International Electron Devices Meeting (IEDM) by swinnen (2006)
{'journal-title': 'Proceedings of the UC Berkeley Extension Advanced Metallization Conference (AMC)', 'year': '2004', 'author': 'morrow', 'key': '1'} / Proceedings of the UC Berkeley Extension Advanced Metallization Conference (AMC) by morrow (2004)
{'year': '0', 'key': '5'} (0)
{'year': '0', 'key': '4'} (0)

Dates

Type	When
Created	16 years, 5 months ago (March 6, 2009, 8:35 a.m.)
Deposited	8 years, 5 months ago (March 17, 2017, 7:29 p.m.)
Indexed	2 months, 2 weeks ago (June 4, 2025, 2:05 a.m.)
Issued	16 years, 8 months ago (Dec. 1, 2008)
Published	16 years, 8 months ago (Dec. 1, 2008)
Published Print	16 years, 8 months ago (Dec. 1, 2008)

Funders 0

None

BibTeX

@inproceedings{Liu_2008, title={A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding}, url={http://dx.doi.org/10.1109/iedm.2008.4796762}, DOI={10.1109/iedm.2008.4796762}, booktitle={2008 IEEE International Electron Devices Meeting}, publisher={IEEE}, author={Liu, F. and Yu, R. R. and Young, A. M. and Doyle, J. P. and Wang, X. and Shi, L. and Chen, K.-N. and Li, X. and Dipaola, D. A. and Brown, D. and Ryan, C. T. and Hagan, J. A. and Wong, K. H. and Lu, M. and Gu, X. and Klymko, N. R. and Perfecto, E. D. and Merryman, A. G. and Kelly, K. A. and Purushothaman, S. and Koester, S. J. and Wisnieff, R. and Haensch, W.}, year={2008}, month=dec, pages={1–4} }

JSON

{
  "indexed": {
    "date-parts": [
      [
        2025,
        6,
        4
      ]
    ],
    "date-time": "2025-06-04T06:05:48Z",
    "timestamp": 1749017148856
  },
  "reference-count": 5,
  "publisher": "IEEE",
  "content-domain": {
    "domain": [],
    "crossmark-restriction": false
  },
  "published-print": {
    "date-parts": [
      [
        2008,
        12
      ]
    ]
  },
  "DOI": "10.1109/iedm.2008.4796762",
  "type": "proceedings-article",
  "created": {
    "date-parts": [
      [
        2009,
        3,
        6
      ]
    ],
    "date-time": "2009-03-06T13:35:12Z",
    "timestamp": 1236346512000
  },
  "page": "1-4",
  "source": "Crossref",
  "is-referenced-by-count": 76,
  "title": "A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding",
  "prefix": "10.1109",
  "author": [
    {
      "given": "F.",
      "family": "Liu",
      "sequence": "first",
      "affiliation": []
    },
    {
      "given": "R. R.",
      "family": "Yu",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "A. M.",
      "family": "Young",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "J. P.",
      "family": "Doyle",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "X.",
      "family": "Wang",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "L.",
      "family": "Shi",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "K.-N.",
      "family": "Chen",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "X.",
      "family": "Li",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "D. A.",
      "family": "Dipaola",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "D.",
      "family": "Brown",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "C. T.",
      "family": "Ryan",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "J. A.",
      "family": "Hagan",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "K. H.",
      "family": "Wong",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "M.",
      "family": "Lu",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "X.",
      "family": "Gu",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "N. R.",
      "family": "Klymko",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "E. D.",
      "family": "Perfecto",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "A. G.",
      "family": "Merryman",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "K. A.",
      "family": "Kelly",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "S.",
      "family": "Purushothaman",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "S. J.",
      "family": "Koester",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "R.",
      "family": "Wisnieff",
      "sequence": "additional",
      "affiliation": []
    },
    {
      "given": "W.",
      "family": "Haensch",
      "sequence": "additional",
      "affiliation": []
    }
  ],
  "member": "263",
  "reference": [
    {
      "journal-title": "International Interconnect Technology Conference(IITC)",
      "year": "2008",
      "author": "tu",
      "key": "3"
    },
    {
      "journal-title": "International Electron Devices Meeting (IEDM)",
      "year": "2006",
      "author": "swinnen",
      "key": "2"
    },
    {
      "journal-title": "Proceedings of the UC Berkeley Extension Advanced Metallization Conference (AMC)",
      "year": "2004",
      "author": "morrow",
      "key": "1"
    },
    {
      "year": "0",
      "key": "5"
    },
    {
      "year": "0",
      "key": "4"
    }
  ],
  "event": "2008 IEEE International Electron Devices Meeting (IEDM)",
  "container-title": "2008 IEEE International Electron Devices Meeting",
  "original-title": [],
  "link": [
    {
      "URL": "http://xplorestaging.ieee.org/ielx5/4786613/4796592/04796762.pdf?arnumber=4796762",
      "content-type": "unspecified",
      "content-version": "vor",
      "intended-application": "similarity-checking"
    }
  ],
  "deposited": {
    "date-parts": [
      [
        2017,
        3,
        17
      ]
    ],
    "date-time": "2017-03-17T23:29:13Z",
    "timestamp": 1489793353000
  },
  "score": 1,
  "resource": {
    "primary": {
      "URL": "http://ieeexplore.ieee.org/document/4796762/"
    }
  },
  "subtitle": [],
  "short-title": [],
  "issued": {
    "date-parts": [
      [
        2008,
        12
      ]
    ]
  },
  "references-count": 5,
  "URL": "http://dx.doi.org/10.1109/IEDM.2008.4796762",
  "relation": {},
  "subject": [],
  "published": {
    "date-parts": [
      [
        2008,
        12
      ]
    ]
  }
}