DOI: 10.1109/iedm.2008.4796734. Through-silicon via and die stacking technologies for microsystems-integration

Through-silicon via and die stacking technologies for microsystems-integration

10.1109/iedm.2008.4796734

Crossref proceedings-article

IEEE

2008 IEEE International Electron Devices Meeting (263)

Bibliography

Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D. S., Soussan, P., Swinnen, B., & Cartuyvels, R. (2008). Through-silicon via and die stacking technologies for microsystems-integration. 2008 IEEE International Electron Devices Meeting, 1â4.

Authors 10

Eric Beyne (first)
Piet De Moor (additional)
Wouter Ruythooren (additional)
Riet Labie (additional)
Anne Jourdain (additional)
Harrie Tilmans (additional)
Deniz Sabuncuoglu Tezcan (additional)
Philippe Soussan (additional)
Bart Swinnen (additional)
Rudi Cartuyvels (additional)

References 8 Referenced 58

10.1109/IITC.2006.1648629
10.1109/IEDM.2001.979562
10.1109/ISSCC.2004.1332632
{'key': '7', 'article-title': 'cost effective 3d-system integration using through-silicon-via technologies', 'author': 'beyne', 'year': '2007', 'journal-title': 'Semi Technology Symposium'} / Semi Technology Symposium / cost effective 3d-system integration using through-silicon-via technologies by beyne (2007)
10.1109/EPTC.2007.4469706
10.1109/TADVP.2007.901772
10.1109/84.846701
{'key': '8', 'article-title': 'sloped through wafer vias for 3d wafer level packaging', 'author': 'sabuncuoglu tezcan', 'year': '2007', 'journal-title': 'Proc 57th IEEE ECTC'} / Proc 57th IEEE ECTC / sloped through wafer vias for 3d wafer level packaging by sabuncuoglu tezcan (2007)

Dates

Type	When
Created	16 years, 5 months ago (March 6, 2009, 8:35 a.m.)
Deposited	8 years, 5 months ago (March 17, 2017, 10:12 a.m.)
Indexed	1 month, 1 week ago (July 13, 2025, 10:50 p.m.)
Issued	16 years, 8 months ago (Dec. 1, 2008)
Published	16 years, 8 months ago (Dec. 1, 2008)
Published Print	16 years, 8 months ago (Dec. 1, 2008)

Funders 0

None

BibTeX

@inproceedings{Beyne_2008, title={Through-silicon via and die stacking technologies for microsystems-integration}, url={http://dx.doi.org/10.1109/iedm.2008.4796734}, DOI={10.1109/iedm.2008.4796734}, booktitle={2008 IEEE International Electron Devices Meeting}, publisher={IEEE}, author={Beyne, Eric and De Moor, Piet and Ruythooren, Wouter and Labie, Riet and Jourdain, Anne and Tilmans, Harrie and Tezcan, Deniz Sabuncuoglu and Soussan, Philippe and Swinnen, Bart and Cartuyvels, Rudi}, year={2008}, month=dec, pages={1–4} }

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