DOI: 10.1109/eptc.2009.5416484. Intermetallics formation and evolution in pure indium joint for cryogenic application

Intermetallics formation and evolution in pure indium joint for cryogenic application

10.1109/eptc.2009.5416484

Crossref proceedings-article

IEEE

2009 11th Electronics Packaging Technology Conference (263)

Bibliography

Cheng, X., Liu, C., & Silberschmidt, V. V. (2009). Intermetallics formation and evolution in pure indium joint for cryogenic application. 2009 11th Electronics Packaging Technology Conference, 562â566.

Authors 3

X. Cheng (first)
C. Liu (additional)
V.V. Silberschmidt (additional)

References 4 Referenced 4

10.1016/S0921-5093(97)00449-8
10.1002/pssa.2211190143
10.1007/BF01154497
{'key': 'ref1', 'first-page': '2362', 'article-title': 'Flip-chip interconnection technology for packaging of VISL operated in liquid nitrogen', 'volume': 'e 74', 'author': 'hashimoto', 'year': '1991', 'journal-title': 'IEICE Transactions'} / IEICE Transactions / Flip-chip interconnection technology for packaging of VISL operated in liquid nitrogen by hashimoto (1991)

Dates

Type	When
Created	15 years, 6 months ago (Feb. 19, 2010, 1:39 p.m.)
Deposited	8 years, 5 months ago (March 18, 2017, 10:29 p.m.)
Indexed	9 months, 3 weeks ago (Oct. 29, 2024, 12:41 p.m.)
Issued	15 years, 8 months ago (Dec. 1, 2009)
Published	15 years, 8 months ago (Dec. 1, 2009)
Published Print	15 years, 8 months ago (Dec. 1, 2009)

Funders 0

None

BibTeX

@inproceedings{Cheng_2009, title={Intermetallics formation and evolution in pure indium joint for cryogenic application}, url={http://dx.doi.org/10.1109/eptc.2009.5416484}, DOI={10.1109/eptc.2009.5416484}, booktitle={2009 11th Electronics Packaging Technology Conference}, publisher={IEEE}, author={Cheng, X. and Liu, C. and Silberschmidt, V.V.}, year={2009}, month=dec, pages={562–566} }

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