DOI: 10.1109/ectc.2002.1008258. Reliability issues of Pb-free solder joints in electronic packaging technology

Reliability issues of Pb-free solder joints in electronic packaging technology

10.1109/ectc.2002.1008258

Crossref proceedings-article

IEEE

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (263)

Bibliography

Tu, K. N., & Zeng, K. (n.d.). Reliability issues of Pb-free solder joints in electronic packaging technology. 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 1194â1200.

Authors 2

K.N. Tu (first)
K. Zeng (additional)

References 37 Referenced 19

{'year': '0', 'author': 'li', 'key': '19'} by li (0)
10.1016/S1359-6454(98)00045-7
10.1007/BF03222944
10.1016/0040-6090(93)90599-K
{'journal-title': 'Lead free electronic assembly based on Sn-Ag-Cu solders', 'year': '2001', 'author': 'peng', 'key': '18'} / Lead free electronic assembly based on Sn-Ag-Cu solders by peng (2001)
10.1016/0001-6160(82)90201-2
10.1007/BF02653344
10.1016/0001-6160(73)90190-9
10.1007/s11664-998-0074-7
10.1103/PhysRevB.49.2030
10.1108/09540910110361730
10.1063/1.1699681 / J Appl Phys by herring (1950)
{'key': '11', 'first-page': '952', 'article-title': 'Brittle interracial fracture of PBGA packages soldered on electroless nickel/immersion gold', 'author': 'mei', 'year': '1998', 'journal-title': 'Proc 48th Electronic Components and Technology Conference'} / Proc 48th Electronic Components and Technology Conference / Brittle interracial fracture of PBGA packages soldered on electroless nickel/immersion gold by mei (1998)
10.1557/JMR.2002.0042
{'key': '21', 'first-page': '337', 'article-title': 'Electromigration studies of flip chip bump solder joints', 'author': 'brandenburg', 'year': '1998', 'journal-title': 'Proc Surface Mount Int Conf Exposition'} / Proc Surface Mount Int Conf Exposition / Electromigration studies of flip chip bump solder joints by brandenburg (1998)
10.1063/1.370627
{'journal-title': '1999 International Roadmap for Semiconductor Technology', 'year': '1999', 'key': '22'} / 1999 International Roadmap for Semiconductor Technology (1999)
10.1063/1.1432443
10.1063/1.371967
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10.1063/1.1357459
{'year': '2002', 'author': 'xu', 'key': '27'} by xu (2002)
10.1016/S1359-6454(98)00348-6
10.1103/PhysRev.85.1060.2 / Phys Rev by herring (1952)
{'year': '0', 'key': '3'} (0)
{'year': '0', 'key': '2'} (0)
10.1016/0001-6160(70)90019-2
{'key': '1', 'first-page': '33', 'volume': '8', 'author': 'cannis', 'year': '2001', 'journal-title': 'Green IC packaging'} / Green IC packaging by cannis (2001)
{'journal-title': 'Whisker Technology', 'year': '1970', 'author': 'levitt', 'key': '30'} / Whisker Technology by levitt (1970)
10.1016/S0927-796X(01)00029-8
10.1557/JMR.2001.0169
10.1016/0001-6160(76)90021-3
10.1007/s11664-001-0139-3
10.1143/JJAP.8.1404
10.1557/JMR.1995.0497
{'journal-title': 'Constitution of Binary Alloys 2nd ed', 'year': '1958', 'author': 'hansen', 'key': '9'} / Constitution of Binary Alloys 2nd ed by hansen (1958)
10.1016/S0927-796X(00)00010-3

Dates

Type	When
Created	22 years, 1 month ago (June 25, 2003, 4:42 p.m.)
Deposited	8 years, 2 months ago (June 15, 2017, 6:39 p.m.)
Indexed	9 months, 4 weeks ago (Oct. 22, 2024, 6:58 p.m.)

Funders 0

None

BibTeX

@inproceedings{Tu, series={ECTC-02}, title={Reliability issues of Pb-free solder joints in electronic packaging technology}, url={http://dx.doi.org/10.1109/ectc.2002.1008258}, DOI={10.1109/ectc.2002.1008258}, booktitle={52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)}, publisher={IEEE}, author={Tu, K.N. and Zeng, K.}, pages={1194–1200}, collection={ECTC-02} }

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