DOI: 10.1109/84.809052. High-rate through-mold electrodeposition of thick (&lt;200 μm) NiFe MEMS components with uniform composition

High-rate through-mold electrodeposition of thick (&lt;200 μm) NiFe MEMS components with uniform composition

10.1109/84.809052

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

Journal of Microelectromechanical Systems (263)

Bibliography

Leith, S. D., & Schwartz, D. T. (1999). High-rate through-mold electrodeposition of thick (<200 Î¼m) NiFe MEMS components with uniform composition. Journal of Microelectromechanical Systems, 8(4), 384â392.

Authors 2

S.D. Leith (first)
D.T. Schwartz (additional)

References 45 Referenced 46

{'key': 'ref39', 'first-page': '697', 'article-title': 'electroplating at high aspect ratio micropatterned electrodes—influence of mass transfer', 'volume': '95 18', 'author': 'bade', 'year': '1995', 'journal-title': 'Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices'} / Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices / electroplating at high aspect ratio micropatterned electrodes—influence of mass transfer by bade (1995)
10.1016/S0013-4686(97)00149-7
10.1007/978-1-4613-0491-3
{'key': 'ref32', 'author': 'guckel', 'year': '1998', 'journal-title': 'Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers'} / Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers by guckel (1998)
10.1109/SOLSEN.1990.109834
10.1016/S0013-4686(99)00162-0
10.1117/12.251214
{'key': 'ref36', 'first-page': '19', 'article-title': 'a micro fluxgate magnetic sensor using micromachined 3-dimensional planar coils', 'author': 'liakopoulos', 'year': '1998', 'journal-title': 'Tech Dig IEEE Solid-State Sensor and Actuator Workshop'} / Tech Dig IEEE Solid-State Sensor and Actuator Workshop / a micro fluxgate magnetic sensor using micromachined 3-dimensional planar coils by liakopoulos (1998)
10.1557/JMR.1992.1564
10.1557/PROC-518-185
10.1149/1.2096917 / J Electrochem Soc / electrodeposition of nickel-iron alloys i. effect of agitation by andricacos (1989)
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10.1149/1.2221118
10.1147/rd.345.0693
{'key': 'ref13', 'first-page': '387', 'article-title': 'electroplating for liga processing', 'volume': '95 18', 'author': 'bonivert', 'year': '1995', 'journal-title': 'Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices'} / Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices / electroplating for liga processing by bonivert (1995)
{'key': 'ref14', 'first-page': '89', 'article-title': 'liga microstructures from a nife-alloy: preparation by electroforming and their magnetic properties', 'volume': '94 6', 'author': 'thommes', 'year': '1993', 'journal-title': 'Proc Electrochem Soc 3rd Int Symp Magnetic Materials Processes and Devices'} / Proc Electrochem Soc 3rd Int Symp Magnetic Materials Processes and Devices / liga microstructures from a nife-alloy: preparation by electroforming and their magnetic properties by thommes (1993)
10.1016/0167-9317(86)90004-3
10.1016/S0924-4247(98)80055-1
10.1149/1.1836415
10.1016/S0924-4247(97)80034-9
10.1109/84.475549
10.1149/1.2044064 / J Electrochem Soc / steady-state characterization of the uniform-injection cell ii. experimental analysis by medina (1995)
10.1016/0924-4247(94)00870-N / Sens Actuators A / magnetically driven microstructures fabricated with multilayer electroplating by lo¨chel (1995)
10.1149/1.1837209
10.1149/1.2044060 / J Electrochem Soc / steady-state characterization of the uniform-injection cell i. theoretical analysis by medina (1995)
10.1109/84.475542
{'key': 'ref5', 'first-page': '411', 'article-title': 'micromachined planar inductors with electroplated nickel-iron permalloy cores (spiral type, solenoid type, and toroidal-meander type)', 'volume': '95 18', 'author': 'ahn', 'year': '1995', 'journal-title': 'Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices'} / Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices / micromachined planar inductors with electroplated nickel-iron permalloy cores (spiral type, solenoid type, and toroidal-meander type) by ahn (1995)
{'key': 'ref29', 'author': 'prentice', 'year': '1991', 'journal-title': 'Electrochemical Engineering Principles'} / Electrochemical Engineering Principles by prentice (1991)
10.1088/0960-1317/3/3/007
10.1002/9783527616770.ch5 / Advances in Electrochemical Science and Engineering / magnetically soft materials in data storage: their properties and electrochemistry by andricacos (1994)
10.1109/20.617930
10.1149/1.2056238
10.1016/S0013-4686(97)00146-1
{'key': 'ref20', 'first-page': '407', 'article-title': 'deep x-ray lithography and electroplating for electromagnetic actuators', 'volume': '95 18', 'author': 'guckel', 'year': '1995', 'journal-title': 'Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices'} / Proc Electrochem Soc 4th Int Symp Magnetic Materials Processes and Devices / deep x-ray lithography and electroplating for electromagnetic actuators by guckel (1995)
10.1007/s005420050044
10.1149/1.1391781 / J Electrochem Soc / characterization of ni<formula><tex>$_x$</tex></formula>fe<formula><tex>$_{1{\hbox{-}}x}$</tex></formula> (<formula><tex>$0.10\le x\le 0.95$</tex></formula>) electrodeposition from a family of sulfamate-chloride electrolytes by leith (1999)
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10.1149/1.2085666
10.1149/1.2044200
10.1149/1.2069205
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{'key': 'ref44', 'article-title': 'liga prototyping at sandia national laboratories', 'author': 'hruby', 'year': '1999', 'journal-title': '3rd Int Workshop for High Aspect Ratio Microstructures (HARMST)'} / 3rd Int Workshop for High Aspect Ratio Microstructures (HARMST) / liga prototyping at sandia national laboratories by hruby (1999)
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{'key': 'ref43', 'author': 'safranek', 'year': '1974', 'journal-title': 'The Properties of Electrodeposited Metals and Alloys'} / The Properties of Electrodeposited Metals and Alloys by safranek (1974)

Dates

Type	When
Created	22 years, 11 months ago (Aug. 24, 2002, 3:31 p.m.)
Deposited	3 years, 8 months ago (Nov. 29, 2021, 3:18 p.m.)
Indexed	2 months, 2 weeks ago (June 2, 2025, 8:07 a.m.)
Issued	26 years, 7 months ago (Jan. 1, 1999)
Published	26 years, 7 months ago (Jan. 1, 1999)
Published Print	26 years, 7 months ago (Jan. 1, 1999)

Funders 0

None

BibTeX

@article{Leith_1999, title={High-rate through-mold electrodeposition of thick (&lt;200 μm) NiFe MEMS components with uniform composition}, volume={8}, ISSN={1057-7157}, url={http://dx.doi.org/10.1109/84.809052}, DOI={10.1109/84.809052}, number={4}, journal={Journal of Microelectromechanical Systems}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Leith, S.D. and Schwartz, D.T.}, year={1999}, pages={384–392} }

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