DOI: 10.1109/77.403046. Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films

Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films

10.1109/77.403046

Crossref journal-article

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Appiled Superconductivity (263)

Bibliography

Sauvageau, J. E., Burroughs, C. J., Booi, P. A. A., Cromar, M. W., Benz, R. P., & Koch, J. A. (1995). Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films. IEEE Transactions on Appiled Superconductivity, 5(2), 2303â2309.

Authors 6

J.E. Sauvageau (first)
C.J. Burroughs (additional)
P.A.A. Booi (additional)
M.W. Cromar (additional)
R.P. Benz (additional)
J.A. Koch (additional)

References 22 Referenced 38

10.1063/1.107929
10.1109/77.233940
10.1116/1.575815
{'key': 'ref13', 'first-page': '116', 'volume': '81', 'author': 'khuri', 'year': '1987', 'journal-title': 'Response Surfaces Designs and Analyses'} / Response Surfaces Designs and Analyses by khuri (1987)
{'key': 'ref14', 'article-title': 'Optimization of ECR-based PECVD oxide films for superconducting integrated circuit fabrication', 'author': 'sauvageau', 'year': '1994', 'journal-title': '37th Annual Technical Conference Proceedings of the Society of Vacuum Coaters'} / 37th Annual Technical Conference Proceedings of the Society of Vacuum Coaters / Optimization of ECR-based PECVD oxide films for superconducting integrated circuit fabrication by sauvageau (1994)
{'key': 'ref15', 'author': 'kaplan', 'year': '0', 'journal-title': 'Cryoelectronic Metrology Group NIST Boulder'} / Cryoelectronic Metrology Group NIST Boulder by kaplan (0)
{'key': 'ref16', 'author': 'bhushan', 'year': '0', 'journal-title': 'Physics Department SUNY Stony Brook'} / Physics Department SUNY Stony Brook by bhushan (0)
10.1149/1.2113757
10.1109/JRPROC.1954.274680
10.1149/1.2133052
10.1149/1.2131517
{'key': 'ref3', 'author': 'mendenhall', 'year': '1992', 'journal-title': 'Statistics for Engineering and the Sciences'} / Statistics for Engineering and the Sciences by mendenhall (1992)
{'key': 'ref6', 'author': 'huber', 'year': '0', 'journal-title': 'Effect of etching parameters on leakage current and voltage noise of Josephson tunnel junctions'} / Effect of etching parameters on leakage current and voltage noise of Josephson tunnel junctions by huber (0)
10.1109/77.257236
10.1109/20.133873
{'key': 'ref7', 'first-page': '765', 'volume': '34', 'author': 'hidaka', 'year': '1987', 'journal-title': 'Advances in Cryogenic Engineering Materials'} / Advances in Cryogenic Engineering Materials by hidaka (1987)
{'key': 'ref2', 'author': 'phadke', 'year': '1989', 'journal-title': 'Quality Engineering Using Robust Design'} / Quality Engineering Using Robust Design by phadke (1989)
10.1007/978-3-642-77457-7_50
{'key': 'ref1', 'author': 'box', 'year': '1978', 'journal-title': 'Statistics for Experiments'} / Statistics for Experiments by box (1978)
10.1109/77.233934
10.1109/20.133782
10.1117/12.933682

Dates

Type	When
Created	22 years, 11 months ago (Aug. 24, 2002, 3:16 p.m.)
Deposited	3 years, 8 months ago (Nov. 29, 2021, 3:14 p.m.)
Indexed	4 months ago (April 21, 2025, 12:43 a.m.)
Issued	30 years, 2 months ago (June 1, 1995)
Published	30 years, 2 months ago (June 1, 1995)
Published Print	30 years, 2 months ago (June 1, 1995)

Funders 0

None

BibTeX

@article{Sauvageau_1995, title={Superconducting integrated circuit fabrication with low temperature ECR-based PECVD SiO/sub 2/ dielectric films}, volume={5}, ISSN={1051-8223}, url={http://dx.doi.org/10.1109/77.403046}, DOI={10.1109/77.403046}, number={2}, journal={IEEE Transactions on Appiled Superconductivity}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Sauvageau, J.E. and Burroughs, C.J. and Booi, P.A.A. and Cromar, M.W. and Benz, R.P. and Koch, J.A.}, year={1995}, month=jun, pages={2303–2309} }

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